D017 High-energy X-ray methods for studying buried interfaces—invited

2006 ◽  
Vol 21 (2) ◽  
pp. 175-175
Author(s):  
H. Reichert
Keyword(s):  
High Energy ◽  
X Ray ◽  
Buried Interfaces ◽  
Ray Methods

scholarly journals Synchrotron high energy X-ray methods coupled to phase sensitive analysis to characterize aging of solid catalysts with enhanced sensitivity

2013 ◽  
Vol 15 (22) ◽  
pp. 8629 ◽  
Author(s):  
Davide Ferri ◽  
Mark A. Newton ◽  
Marco Di Michiel ◽  
Songhak Yoon ◽  
Gian Luca Chiarello ◽  
...  
Keyword(s):  
High Energy ◽  
Sensitive Analysis ◽  
X Ray ◽  
Solid Catalysts ◽  
Enhanced Sensitivity ◽  
Phase Sensitive ◽  
Ray Methods

Investigations of Buried Interfaces Using High Energy X-Ray Reflectivity

2001 ◽  
Vol 678 ◽  
Author(s):  
F. Rieutord ◽  
J. Eymery ◽  
O. Plantevin ◽  
B. Bataillou ◽  
D. Buttard ◽  
...  
Keyword(s):  
Grazing Angle ◽  
High Energy ◽  
Silicon On Insulator ◽  
Nanometer Scale ◽  
X Rays ◽  
X Ray ◽  
Buried Interfaces ◽  
High Penetration ◽  
Silicon Silicon ◽  
Insulator Substrate

AbstractX-ray reflectivity using high-energy X-rays allows one to characterize interfaces between thick materials at nanometer scale. The technique combines the high penetration of X-rays allowing the crossing of the radiation through large thicknesses of material with the interface sensitivity of grazing angle techniques. In the case of a buried interface between two thick materials, the beam enters the sample through the side of one material and contributions of external surfaces are suppressed. Then, the technique is sensitive to the interface structure only. Examples are given using wafer bonding interfaces, both in the hydrophilic case (as used e.g. in Silicon-On-Insulator substrate fabrication) and in the hydrophobic case (Silicon/Silicon bonding).

scholarly journals A sample chamber for in situ high-energy X-ray studies of crystal growth at deeply buried interfaces in harsh environments

2015 ◽  
Vol 420 ◽  
pp. 84-89 ◽  
Author(s):  
A.E.F. de Jong ◽  
V. Vonk ◽  
V. Honkimäki ◽  
B. Gorges ◽  
H. Vitoux ◽  
...  
Keyword(s):  
Crystal Growth ◽  
High Energy ◽  
Harsh Environments ◽  
X Ray ◽  
Buried Interfaces ◽  
Sample Chamber

Formation of Substructure and Texture in Dual-Phase Steels due to Thermal Treatment

2010 ◽  
Vol 160 ◽  
pp. 147-152
Author(s):  
M. Masimov ◽  
Helmut Klein
Keyword(s):  
Synchrotron Radiation ◽  
Thermal Treatment ◽  
High Energy ◽  
Dual Phase ◽  
Texture Formation ◽  
X Ray ◽  
Dp Steels ◽  
Initial Texture ◽  
Bcc Phase ◽  
Ray Methods

Microstructure and texture formation in DP steels obtained by thermal treatment at temperatures of 780 °C i.e. between Ac1 and Ac3 and at 900 °C, i.e. above Ac3 and following different cooling techniques were studied by means of X-ray and electron diffraction techniques. The formation of the different structure constituents as well as substructure parameters such as blocks size and misorientation between them induced by thermal treatment was detailed analyzed. Various methods – conventional X-ray methods, high-energy synchrotron radiation and EBSD measuring – the texture of the bcc phase were applied in order to investigate their influence on the results. Beside texture heredity, a softening of the initial texture components induced by cold rolling and of related anisotropy of steels due to thermal treatment was estimated.

High-energy x-ray reflectivity of buried interfaces created by wafer bonding

2001 ◽  
Vol 63 (12) ◽  
Author(s):  
F. Rieutord ◽  
J. Eymery ◽  
F. Fournel ◽  
D. Buttard ◽  
R. Oeser ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
High Energy ◽  
X Ray ◽  
Buried Interfaces

A new X-ray transmission-reflection scheme for the study of deeply buried interfaces using high-energy microbeams

2003 ◽  
Vol 336 (1-2) ◽  
pp. 46-55 ◽  
Author(s):  
H Reichert ◽  
V Honkimäki ◽  
A Snigirev ◽  
S Engemann ◽  
H Dosch
Keyword(s):  
High Energy ◽  
X Ray ◽  
Buried Interfaces

High-purity Ge x-ray detectors: Sensitivity factors and usefulness

1990 ◽  
Vol 48 (2) ◽  
pp. 548-548
Author(s):  
E. B. Steel
Keyword(s):  
High Purity ◽  
High Energy ◽  
Quantitative Chemical Analysis ◽  
Detector Performance ◽  
X Ray ◽  
Detector Sensitivity ◽  
Specimen Holder ◽  
Many Instruments ◽  
Charge Resolution ◽  
Sensitivity Factors

High Purity Germanium (HPGe) x-ray detectors are now commercially available for the analytical electron microscope (AEM). The detectors have superior efficiency at high x-ray energies and superior resolution compared to traditional lithium-drifted silicon [Si(Li)] detectors. However, just as for the Si(Li), the use of the HPGe detectors requires the determination of sensitivity factors for the quantitative chemical analysis of specimens in the AEM. Detector performance, including incomplete charge, resolution, and durability has been compared to a first generation detector. Sensitivity factors for many elements with atomic numbers 10 through 92 have been determined at 100, 200, and 300 keV. This data is compared to Si(Li) detector sensitivity factors.The overall sensitivity and utility of high energy K-lines are reviewed and discussed. Many instruments have one or more high energy K-line backgrounds that will affect specific analytes. One detector-instrument-specimen holder combination had a consistent Pb K-line background while another had a W K-line background.

Designing high-resolution slow scan CCD-based TEM camera systems

1992 ◽  
Vol 50 (2) ◽  
pp. 946-947
Author(s):  
James F. Mancuso ◽  
William B. Maxwell ◽  
Russell E. Camp ◽  
Mark H. Ellisman
Keyword(s):  
Fiber Optics ◽  
Ccd Camera ◽  
High Energy ◽  
Phosphor Layer ◽  
X Ray ◽  
Light Production ◽  
Camera Systems ◽  
X Ray Imaging ◽  
Electron Image ◽  
Scintillating Fiber

The imaging requirements for 1000 line CCD camera systems include resolution, sensitivity, and field of view. In electronic camera systems these characteristics are determined primarily by the performance of the electro-optic interface. This component converts the electron image into a light image which is ultimately received by a camera sensor.Light production in the interface occurs when high energy electrons strike a phosphor or scintillator. Resolution is limited by electron scattering and absorption. For a constant resolution, more energy deposition occurs in denser phosphors (Figure 1). In this respect, high density x-ray phosphors such as Gd2O2S are better than ZnS based cathode ray tube phosphors. Scintillating fiber optics can be used instead of a discrete phosphor layer. The resolution of scintillating fiber optics that are used in x-ray imaging exceed 20 1p/mm and can be made very large. An example of a digital TEM image using a scintillating fiber optic plate is shown in Figure 2.

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