D029 X-ray Stress Analysis Method Based on Laue Symmetries for Thin Films

2003 ◽  
Vol 18 (2) ◽  
pp. 178-178
Author(s):  
R. Yokoyama ◽  
J. Harada ◽  
K. Tanaka
Keyword(s):  
Thin Films ◽  
Stress Analysis ◽  
Analysis Method ◽  
X Ray

Advanced x-ray stress analysis method for a single crystal using different diffraction plane families

2008 ◽  
Vol 92 (23) ◽  
pp. 231903 ◽  
Author(s):  
Muneyuki Imafuku ◽  
Hiroshi Suzuki ◽  
Kazuyuki Sueyoshi ◽  
Koichi Akita ◽  
Shin-ichi Ohya
Keyword(s):  
Single Crystal ◽  
Stress Analysis ◽  
Analysis Method ◽  
Diffraction Plane ◽  
X Ray

Rietveld Texture and Stress Analysis of Thin Films by X-Ray Diffraction

2002 ◽  
Vol 408-412 ◽  
pp. 1603-1608 ◽  
Author(s):  
Luca Lutterotti ◽  
Siegfried Matthies ◽  
Daniel Chateigner ◽  
Sandro Ferrari ◽  
Jesús Ricote
Keyword(s):  
Thin Films ◽  
Stress Analysis ◽  
X Ray Diffraction ◽  
X Ray

Deposition of TiO2 Thin Films Using Magnetron Sputtering

2011 ◽  
Vol 217-218 ◽  
pp. 1743-1746
Author(s):  
Xing Long Guo
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Magnetron Sputtering ◽  
Profile Analysis ◽  
Line Profile Analysis ◽  
Analysis Method ◽  
X Ray Diffraction ◽  
X Ray ◽  
Average Grain Size ◽  
Diffraction Patterns

TiO2 with 20nm in diameter have been prepared by using magnetron sputtering technique. The structure of these powers was determined by X-ray diffraction experiments. The average grain size and particle size in these powers were measured by the line profile analysis method of X-ray diffraction patterns and by scan electron microscopy, respectively. The thin films were investigated by using XRD, SEM measurements.

Diffraction stress analysis of highly planar-faulted, macroscopically elastically anisotropic thin films and application to tensilely loaded nanocrystalline Ni and Ni(W)

2014 ◽  
Vol 47 (1) ◽  
pp. 291-302 ◽  
Author(s):  
Silke Julia Birgit Kurz ◽  
Udo Welzel ◽  
Ewald Bischoff ◽  
Eric Jan Mittemeijer
Keyword(s):  
Thin Films ◽  
Stress State ◽  
Stress Analysis ◽  
Biaxial Stress ◽  
Stress Factors ◽  
Group Method ◽  
Analysis Method ◽  
Biaxial Stress State ◽  
Successful Separation ◽  
Increased Strength

The presence of planar faults complicates the diffraction stress analysis enormously owing to fault-induced displacement, broadening and asymmetry of the Bragg reflections. A dedicated stress-analysis method has been developed for highly planar-faulted, fibre-textured thin films of cubic crystal symmetry, using only specific reflections for diffraction stress analysis. The effect of unjustified use of other reflections has been demonstrated in the course of application of the method to Ni and Ni(W) thin films exhibiting excessive faulting and subjected to (1) a planar, rotationally symmetric stress state and (2) a planar biaxial stress state. In case 1 the crystallite-group method has been used, whereas in case 2 the stress-analysis method based on X-ray stress factors had to be applied. The successful separation of stress- and fault-induced reflection displacements has enabled the investigation of the mechanical behaviour of Ni and Ni(W) thin films byin situstress measurements during tensile loading, thereby exposing pronounced stiffness and increased strength by alloying with W.

New Generation X-Ray Stress Measurement Using Debye Ring Image Data by Two-Dimensional Detection

2014 ◽  
Vol 783-786 ◽  
pp. 2103-2108 ◽  
Author(s):  
Toshihiko Sasaki
Keyword(s):  
Stress Analysis ◽  
Generation X ◽  
Stress Measurement ◽  
Image Data ◽  
Two Dimensional ◽  
Analysis Method ◽  
X Ray ◽  
Debye Ring ◽  
New Type ◽  
New Generation

Measuring theory of two types of X-ray stress analysis method was compared with each other. One is the conventional method, in which zero-or one-dimensional detector is used for obtaining diffracted beam and stress is determined using the standard sin2ψ method. Another is the new type of X-ray stress analysis method, in which two-dimensional detector is used to obtain whole Debye ring and stress is determined using the cosα method. An experiment was conducted to investigate the validity.

P23 Generalization of X-ray stress analysis method for single crystals with unknown stress-free lattice parameter

2006 ◽  
Vol 2006 (0) ◽  
pp. 565-566
Author(s):  
Kazuyuki SUEYOSHI ◽  
Hiroshi SUZUKI ◽  
Koichi AKITA ◽  
Muneyuki IMAFUKU ◽  
Shin-ichi OHYA
Keyword(s):  
Stress Analysis ◽  
Single Crystals ◽  
Lattice Parameter ◽  
Free Lattice ◽  
Analysis Method ◽  
X Ray

Residual Stress Analysis of Al Alloy Thin Films by X-Ray Diffraction as a Function of Film Thickness

1988 ◽  
Vol 130 ◽  
Author(s):  
Carla J. Shute ◽  
J. B. Cohen ◽  
D. A. Jeannottea
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Film Thickness ◽  
Stress Analysis ◽  
Metal Film ◽  
High Stress ◽  
Al Alloy ◽  
X Ray Diffraction ◽  
X Ray ◽  
Residual Stress Analysis

AbstractResidual stress has been measured as a function of layer thickness in thin films of an Al alloy on oxidized Si by the x-ray “d” versus sin2ψ technique. Samples with and without a passivation layer were examined. The results show an increase in residual stress with decreasing film thickness for the passivated samples and indicates that the interface between the metal film and SiO2 may be a region of high stress.

Determination of the fracture strength for ceramic film on substrate by X-ray stress analysis method

2006 ◽  
Vol 56 (3) ◽  
pp. 208-213 ◽  
Author(s):  
M. Qin ◽  
D.Y. Ju ◽  
Y.N. Wu ◽  
C. Sun ◽  
J.B. Li
Keyword(s):  
Stress Analysis ◽  
Fracture Strength ◽  
Analysis Method ◽  
X Ray ◽  
Ceramic Film
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