Hydrogen-Induced Reversible Changes in Drain Current of Pt-Gated AlGaN/GaN High Electron Mobility Transistors (HEMT)

2005 ◽  
Keyword(s):  
Electron Mobility ◽  
Drain Current ◽  
High Electron Mobility Transistors ◽  
High Electron ◽  
High Electron Mobility ◽  
Electron Mobility Transistors

Integrated GaN/AlGaN/GaN HEMTs with Preciously Controlled Resistance on Silicon Substrate Fabricated by Ion Implantation

2008 ◽  
Vol 1068 ◽  
Author(s):  
Kazuki Nomoto ◽  
Tomo Ohsawa ◽  
Masataka Satoh ◽  
Tohru Nakamura
Keyword(s):  
Ion Implantation ◽  
Electron Mobility ◽  
Silicon Substrate ◽  
Drain Current ◽  
High Electron Mobility Transistors ◽  
High Electron ◽  
High Electron Mobility ◽  
Electron Mobility Transistors ◽  
Gan Hemts ◽  
Ion Implanted

ABSTRACTMultiple ion-implanted GaN/AlGaN/GaN high electron-mobility transistors (HEMTs) and preciously controlled ion-implanted resistors integrated on silicon substrate are reported. Using ion implantation into source/drain (S/D) regions, the performances were significantly improved. On-resistance reduced from 10.3 to 3.5 Ω•mm. Saturation drain current and maximum transconductance increased from 390 to 650 mA/mm and from 130 to 230 mS/mm. Measured transfer curve shows that I/O gain of 4.5 can be obtained at Vdd = 10 V.

Fabrication and characterization of AlGaN/GaN HEMTs with high power gain and efficiency at 8 GHz

2021 ◽  
Vol 42 (12) ◽  
pp. 122802
Author(s):  
Quan Wang ◽  
Changxi Chen ◽  
Wei Li ◽  
Yanbin Qin ◽  
Lijuan Jiang ◽  
...  
Keyword(s):  
High Power ◽  
Electron Mobility ◽  
Drain Current ◽  
High Electron Mobility Transistors ◽  
High Electron ◽  
Power Gain ◽  
High Electron Mobility ◽  
Power Added Efficiency ◽  
Electron Mobility Transistors ◽  
Dimensional Electron Gas

Abstract State-of-the-art AlGaN/GaN high electron mobility structures were grown on semi-insulating 4H-SiC substrates by MOCVD and X-band microwave power high electron mobility transistors were fabricated and characterized. Hall mobility of 2291.1 cm2/(V·s) and two-dimensional electron gas density of 9.954 × 1012 cm–2 were achieved at 300 K. The HEMT devices with a 0.45-μm gate length exhibited maximum drain current density as high as 1039.6 mA/mm and peak extrinsic transconductance of 229.7 mS/mm. The f T of 30.89 GHz and f max of 38.71 GHz were measured on the device. Load-pull measurements were performed and analyzed under (–3.5, 28) V, (–3.5, 34) V and (–3.5, 40) V gate/drain direct current bias in class-AB, respectively. The uncooled device showed high linear power gain of 17.04 dB and high power-added efficiency of 50.56% at 8 GHz when drain biased at (–3.5, 28) V. In addition, when drain biased at (–3.5, 40) V, the device exhibited a saturation output power density up to 6.21 W/mm at 8 GHz, with a power gain of 11.94 dB and a power-added efficiency of 39.56%. Furthermore, the low f max/f T ratio and the variation of the power sweep of the device at 8 GHz with drain bias voltage were analyzed.

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