Annealing Induced Interfacial Evolution of Titanium/Gold Metallization on Unintentionally Dopedβ-Ga2O3

2019 ◽  
Vol 8 (7) ◽  
pp. Q3176-Q3179
Author(s):  
Ming-Hsun Lee ◽  
Rebecca L. Peterson
Keyword(s):  
Interfacial Evolution ◽  
Gold Metallization

Electromigration and Electrochemical Reaction Mixed Failure Mechanism in Gold Interconnection System

1999 ◽  
Author(s):  
Hide Murayama ◽  
Makoto Yamazaki ◽  
Shigeru Nakajima
Keyword(s):  
Failure Mechanism ◽  
Failure Rate ◽  
Electrochemical Reaction ◽  
Dielectric Films ◽  
Failure Rates ◽  
Interlayer Dielectric ◽  
Bipolar Devices ◽  
Gold Metallization

Abstract Power bipolar devices with gold metallization experience high failure rates. The failures are characterized as shorts, detected during LSI testing at burn-in. Many of these shorted locations are the same for the failed devices. From a statistical lot analysis, it is found that the short failure rate is higher for devices with thinner interlayer dielectric films. Based upon these results, a new electromigration and electrochemical reaction mixed failure mechanism is proposed for the failure.

In situ AFM of interfacial evolution at magnesium metal anode

2021 ◽  
Vol 896 ◽  
pp. 115301
Author(s):  
Xin-Cheng Hu ◽  
Shuang-Yan Lang ◽  
Yang Shi ◽  
Rui Wen ◽  
Li-Jun Wan
Keyword(s):  
Magnesium Metal ◽  
Metal Anode ◽  
Interfacial Evolution

Interfacial Evolution Behavior of ZrO 2 (ZrB 2 ) Active Diffusion Barrier

2018 ◽  
Vol 47 (5) ◽  
pp. 1365-1369
Author(s):  
Liu Lintao ◽  
Li Zhengxian ◽  
Yang Chenxi ◽  
He Fei
Keyword(s):  
Diffusion Barrier ◽  
Evolution Behavior ◽  
Interfacial Evolution

scholarly journals Effects of temperature on interfacial evolution and mechanical properties of pure titanium and carbon steel sheets bonded via new multi-pass continuous hot-roll diffusion with nickel interlayer

2021 ◽  
Author(s):  
Chun-Ming Jimmy Lin ◽  
Mohsen Saboktakin Rizi ◽  
Chia-Kai Chen
Keyword(s):  
Mechanical Properties ◽  
Carbon Steel ◽  
Pure Titanium ◽  
Engineering Application ◽  
Peel Strength ◽  
Processing Temperature ◽  
Diffusion Treatment ◽  
Steel Sheets ◽  
New Type ◽  
Interfacial Evolution

Abstract This study performed experiments and thermodynamic calculations to elucidate the effects of diffusion temperature on interfacial evolution and mechanical properties of pure titanium and carbon steel (i.e., steel) sheets bonded via a new type of multi-pass continuous hot-roll diffusion with nickel interlayer. The interfacial evolution results revealed that this new type of multi-pass continuous hot-roll diffusion treatment showed a very good adherence due to its metallurgy bonding, because it made a remarked improve to between compound and intermetallic compounds relationship. Secondly, in mechanical properties results revealed that the highest shear strength (∼470 MPa) was obtained at a processing temperature of 850°C. The highest peel strength (∼21 N/mm) was obtained in the sample processed at 900°C. Bonding temperatures above and below these levels reduced the bond strength respectively due to poor atom diffusion and excessive compound formation, resulting in joint failure at the Ti-Ni interface. Extensive cleavage planes with various alignments were observed on the fracture surfaces in these cases. Overall, a hot-rolling temperature of 850°C was found to provide the optimal tradeoff between interfacial bonding strength and ductility. This work provided an economical and convenient solution for broadening the engineering application of interface between sheets of pure titanium and steel.

scholarly journals Bonding of Aluminum Alloy by Hot-Dipping Tin Coating

2008 ◽  
Vol 32 ◽  
pp. 93-98 ◽  
Author(s):  
Hui Diao ◽  
Chun Qing Wang ◽  
Lei Wang
Keyword(s):  
Shear Strength ◽  
Aluminum Alloy ◽  
Optical Microscopy ◽  
Electronic Industry ◽  
Tin Coating ◽  
Bonding Technology ◽  
Interfacial Evolution ◽  
Soldered Joint

This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.

Silicon-based microelectrodes for neurophysiology fabricated using a gold metallization/nitride passivation system

1996 ◽  
Vol 5 (2) ◽  
pp. 117-121 ◽  
Author(s):  
G. Ensell ◽  
D.J. Banks ◽  
D.J. Ewins ◽  
W. Balachandran ◽  
P.R. Richards
Keyword(s):  
Silicon Based ◽  
Gold Metallization
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