Growth and interfacial evolution of oriented C60 overlayers on Au(111)

1995 ◽  
Vol 67 (26) ◽  
pp. 3901-3903 ◽  
Author(s):  
A. Fartash
Keyword(s):  
Interfacial Evolution

In situ AFM of interfacial evolution at magnesium metal anode

2021 ◽  
Vol 896 ◽  
pp. 115301
Author(s):  
Xin-Cheng Hu ◽  
Shuang-Yan Lang ◽  
Yang Shi ◽  
Rui Wen ◽  
Li-Jun Wan
Keyword(s):  
Magnesium Metal ◽  
Metal Anode ◽  
Interfacial Evolution

Interfacial Evolution Behavior of ZrO 2 (ZrB 2 ) Active Diffusion Barrier

2018 ◽  
Vol 47 (5) ◽  
pp. 1365-1369
Author(s):  
Liu Lintao ◽  
Li Zhengxian ◽  
Yang Chenxi ◽  
He Fei
Keyword(s):  
Diffusion Barrier ◽  
Evolution Behavior ◽  
Interfacial Evolution

scholarly journals Effects of temperature on interfacial evolution and mechanical properties of pure titanium and carbon steel sheets bonded via new multi-pass continuous hot-roll diffusion with nickel interlayer

2021 ◽  
Author(s):  
Chun-Ming Jimmy Lin ◽  
Mohsen Saboktakin Rizi ◽  
Chia-Kai Chen
Keyword(s):  
Mechanical Properties ◽  
Carbon Steel ◽  
Pure Titanium ◽  
Engineering Application ◽  
Peel Strength ◽  
Processing Temperature ◽  
Diffusion Treatment ◽  
Steel Sheets ◽  
New Type ◽  
Interfacial Evolution

Abstract This study performed experiments and thermodynamic calculations to elucidate the effects of diffusion temperature on interfacial evolution and mechanical properties of pure titanium and carbon steel (i.e., steel) sheets bonded via a new type of multi-pass continuous hot-roll diffusion with nickel interlayer. The interfacial evolution results revealed that this new type of multi-pass continuous hot-roll diffusion treatment showed a very good adherence due to its metallurgy bonding, because it made a remarked improve to between compound and intermetallic compounds relationship. Secondly, in mechanical properties results revealed that the highest shear strength (∼470 MPa) was obtained at a processing temperature of 850°C. The highest peel strength (∼21 N/mm) was obtained in the sample processed at 900°C. Bonding temperatures above and below these levels reduced the bond strength respectively due to poor atom diffusion and excessive compound formation, resulting in joint failure at the Ti-Ni interface. Extensive cleavage planes with various alignments were observed on the fracture surfaces in these cases. Overall, a hot-rolling temperature of 850°C was found to provide the optimal tradeoff between interfacial bonding strength and ductility. This work provided an economical and convenient solution for broadening the engineering application of interface between sheets of pure titanium and steel.

scholarly journals Bonding of Aluminum Alloy by Hot-Dipping Tin Coating

2008 ◽  
Vol 32 ◽  
pp. 93-98 ◽  
Author(s):  
Hui Diao ◽  
Chun Qing Wang ◽  
Lei Wang
Keyword(s):  
Shear Strength ◽  
Aluminum Alloy ◽  
Optical Microscopy ◽  
Electronic Industry ◽  
Tin Coating ◽  
Bonding Technology ◽  
Interfacial Evolution ◽  
Soldered Joint

This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.

The interfacial evolution between polycarbonate-based polymer electrolyte and Li-metal anode

2018 ◽  
Vol 397 ◽  
pp. 157-161 ◽  
Author(s):  
Chen Wang ◽  
Huanrui Zhang ◽  
Jiedong Li ◽  
Jingchao Chai ◽  
Shanmu Dong ◽  
...  
Keyword(s):  
Polymer Electrolyte ◽  
Metal Anode ◽  
Li Metal Anode ◽  
Interfacial Evolution

scholarly journals Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

Materials ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4240
Author(s):  
Qingfeng Wang ◽  
Hong Chen ◽  
Fengjiang Wang
Keyword(s):  
Interfacial Reaction ◽  
Thermal Aging ◽  
Solder Joints ◽  
Depressing Effect ◽  
Aging Condition ◽  
Obvious Effect ◽  
Cu Substrate ◽  
Zn Addition ◽  
Reliability Of Solder Joints ◽  
Interfacial Evolution

Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

Sign in / Sign up

Export Citation Format

Share Document