Enhanced Photovoltaic Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells by Rear Electroplated Copper

2017 ◽  
Vol 6 (8) ◽  
pp. P561-P565 ◽  
Author(s):  
Chi-Chung Liu ◽  
Chin-Lung Cheng ◽  
Jia-Sheng Siao ◽  
Guo-Min Hong
2020 ◽  
Vol 2020 ◽  
pp. 1-5
Author(s):  
Chin-Lung Cheng ◽  
Chi-Chung Liu ◽  
Chih-Chieh Hsu

Photovoltaic characteristics of screen-printed monocrystalline silicon solar cells (SPSSCs) with molybdenum oxide (MoO x ) as hole-selective layers (HSLs) were demonstrated. A H2/Ar plasma pretreatment (PPT) was incorporated into a MoO x /p-Si(100) interface, which shows the expected quality in terms of passivation. Moreover, the charge trapping characteristics of the MoO x /p-Si(100) interface were presented. The PPT parameters, including power, treated time, flow ratio of H2/Ar, and temperature, were investigated. The experimental results indicate that the Si-H bond with a relatively high intensity was demonstrated for the H2/Ar PPT. The achievement of a conversion efficiency (CE) improvement of more than 1.2% absolute from 18.3% to 19.5% for SPSSCs with H2/Ar PPT was explored. The promoted mechanism was attributed to the reduction of the interface trap density caused by the large number of Si-H bonds at the silicon substrate and MoO x interface.


2019 ◽  
Vol 2019 ◽  
pp. 1-9 ◽  
Author(s):  
Chin-Lung Cheng ◽  
Chi-Chung Liu ◽  
Chun-Tin Yeh

Photovoltaic and physical characteristics of screen-printed monocrystalline silicon solar cells (SPMSCs) were presented with electroplated copper (EPC) as the rear contact. The boron back surface field (B-BSF) formed by spin-on doping and laser doping (LD) was prepared as a seed layer for the EPC. The LD parameters, including the laser focus, laser power, laser speed, and laser line pitch, were investigated. Moreover, the effects of KOH etching on the surface properties after the LD process were explored. Furthermore, to enhance the adhesion between the B-BSF seed layer and EPC contact layer, a laser pinhole process was proposed. Finally, the EPC processes with various electroplating times were addressed. The results revealed that the mechanism of enhancements could be attributed to a continuous B-BSF seed layer and a reduction of series resistance, as well as an increase of open-circuit voltage and adhesion between the B-BSF seed layer and EPC contact layer.


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