scholarly journals Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity

2015 ◽  
Vol 4 (7) ◽  
pp. P251-P257 ◽  
Author(s):  
N. Malik ◽  
E. Poppe ◽  
K. Schjølberg-Henriksen ◽  
M. M. V. Taklo ◽  
T. G. Finstad
2015 ◽  
Vol 4 (7) ◽  
pp. P236-P241 ◽  
Author(s):  
N. Malik ◽  
H. R. Tofteberg ◽  
E. Poppe ◽  
T. G. Finstad ◽  
K. Schjølberg-Henriksen

2005 ◽  
Author(s):  
J.M. Duffalo ◽  
J.E. Staszkow ◽  
J.A. Chan ◽  
P.D. Egelhoff ◽  
H.A. Pollack ◽  
...  

1997 ◽  
Vol 40 (1) ◽  
pp. 41-46
Author(s):  
Hank Caruso

This paper provides the newcomer to or casual practitioner of environmental reliability testing with an integrated overview of important issues and considerations associated with accelerated reliability testing. These include step-stress testing, durability test time compression, and environmental stress screening. Other issues include the purpose of the test, the information needs of the customer, and the optimum level of assembly for testing. This information is presented in the form of a question and answer thought process that can be applied in commercial or military test situations.


2009 ◽  
Vol 27 (11) ◽  
pp. 1527-1532 ◽  
Author(s):  
R. Dinu ◽  
Dan Jin ◽  
Guomin Yu ◽  
Baoquan Chen ◽  
Diyun Huang ◽  
...  

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