Effects of Ar Plasma Treatment on the Properties of TaN/Ta Barrier for Copper Interconnects in Advanced 3D NAND Memory
2019 ◽
Vol 8
(12)
◽
pp. P764-P767
◽
2018 ◽
Vol 225
◽
pp. 121-127
◽
Keyword(s):
2017 ◽
Vol 8
(5)
◽
pp. 763-768
◽
Keyword(s):
2014 ◽
Vol 118
(49)
◽
pp. 28440-28447
◽
2019 ◽
Vol 34
◽
pp. 43-48
◽
Keyword(s):
2013 ◽
Vol 27
(16)
◽
pp. 1828-1839
◽
2000 ◽
Vol 147
(3)
◽
pp. 1186
◽
Keyword(s):
2013 ◽
Vol 137
(3)
◽
pp. 689-693
◽
1989 ◽
Vol 53
(9)
◽
pp. 866-872
◽