Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives
2014 ◽
Vol 161
(9)
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pp. D388-D394
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2015 ◽
Vol 46
(1)
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pp. 39-46
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2019 ◽
Vol 2019
(1)
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pp. 000046-000050
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1993 ◽
Vol 140
(11)
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pp. 3167-3175
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Keyword(s):