Fenton-Like Reaction between Copper Ions and Hydrogen Peroxide for High Removal Rate of Tungsten in Chemical Mechanical Planarization

2018 ◽  
Vol 7 (3) ◽  
pp. P91-P95 ◽  
Author(s):  
Kijung Kim ◽  
Kangchun Lee ◽  
Sounghyun So ◽  
Sungwook Cho ◽  
Myeongjae Lee ◽  
...  
Keyword(s):  
Hydrogen Peroxide ◽  
Copper Ions ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
High Removal Rate

Understanding Selectivity on Germanium/SiO2 Chemical Mechanical Planarization Through Design of Experiments

2015 ◽  
Vol 1790 ◽  
pp. 19-24
Author(s):  
Ayse Karagoz ◽  
James Mal ◽  
G. Bahar Basim
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Active Agent ◽  
Chemical Mechanical Planarization ◽  
Sodium Dodecyl ◽  
Active Agent ◽  
High Mobility ◽  
High Removal Rate ◽  
The Impact

ABSTRACTThe continuous trend of achieving more complex microelectronics with smaller nodes yet larger wafer sizes in microelectronics manufacturing lead to aggressive development requirements for chemical mechanical planarization (CMP) process. Particularly, beyond the 14 nm technology the development needs made it a must to introduce high mobility channel materials such as Ge. CMP is an enabler for integration of these new materials into future devices. In this study, we implemented a design of experiment (DOE) methodology in order to understand the optimized CMP slurry parameters such as optimal concentration of surface active agent (sodium dodecyl sulfate-SDS), concentration of abrasive particles and pH from the viewpoint of high removal rate and selectivity while maintaining a defect free surface finish. The responses examined were particle size distribution (slurry stability), zeta potential, material removal rate (MRR) and the surface defectivity as a function of the selected design variables. The impact of fumed silica particle loadings, oxidizer (H2O2) concentration, SDS surfactant concentration and pH were analyzed on Ge/silica selectivity through material removal rate (MRR) surface roughness and defectivity analyses.

Effect of Complex Agent on Copper Dissolution in Alkaline Slurry for Chemical Mechanical Planarization

2012 ◽  
Vol 455-456 ◽  
pp. 1145-1148
Author(s):  
Yan Gang He ◽  
Jia Xi Wang ◽  
Xiao Wei Gan ◽  
Wei Juan Li ◽  
Yu Ling Liu
Keyword(s):  
Surface Roughness ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Dielectric Materials ◽  
Mechanism Analysis ◽  
Copper Dissolution ◽  
Complex Agent ◽  
High Removal Rate ◽  
Rc Delay ◽  
Low K

With the microelectronic technology node moves down to 45 nm and beyond, and to reduce the RC delay time, low-k dielectric materials have been used to replace regular dielectric materials. Therefore, the down force of chemical mechanical planarization (CMP) needs to decrease based on the characteristics of low-k materials: low mechanical strength. In this study, the effect of new complex agent on copper dissolution in alkaline slurry for CMP was investigated. Based on the reaction mechanism analysis of Cu in alkaline slurry in CMP, the performance of Cu removal rate and surface roughness condition were discussed. It has been confirmed that Cu1 slurry demonstrates a relatively high removal rate with low down force. And also, by utilizing the Cu1 slurry, good result of Cu surface roughness were obtained.

Chemical-Mechanical Planarization of Copper: The Effect of Inhibitor and Complexing Agent

2003 ◽  
Vol 767 ◽  
Author(s):  
Ying Luo ◽  
Tianbao Du ◽  
Vimal Desai
Keyword(s):  
Hydrogen Peroxide ◽  
Photoelectron Spectroscopy ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Electrochemical Process ◽  
Copper Removal ◽  
Alkaline Condition ◽  
Complexing Agent ◽  
Polarization Studies ◽  
Cu Cmp

AbstractThe present investigation was focused on understanding of the oxidation, dissolution and modification of Cu surface in slurries at various pH using hydrogen peroxide as oxidizer, glycine as complexing agent and 3-amino-triazol (ATA) as inhibitor during Cu-CMP. The electrochemical process involved in the oxidative dissolution of copper was investigated by potentiodynamic polarization studies. Surface modification of copper was investigated using Xray photoelectron spectroscopy to understand the interaction of Cu-H2O2-glycine-ATA during CMP. In the absence of glycine and ATA, the copper removal rate is found to be high in a slurry with 5% H2O2 at pH 2, then it decreases with increasing pH and reaches the minimum at pH 6, it continuously increases at alkaline condition. In the presence of 0.01M glycine, the removal rate of copper decreases in acidic slurries while increases significantly in alkaline slurries. With the further addition of ATA, the copper removal rate was reduced. However, better surface planarity was obtained. The present investigation enhanced understanding of the mechanism of Cu CMP in the presence of oxidizer, complexing agent and inhibitor for formulation of a highly effective CMP-slurry.

The role of copper ions in hydrogen peroxide bleaching: Their origin, removal, and effect on pulp quality

TAPPI Journal ◽  
2012 ◽  
Vol 11 (7) ◽  
pp. 37-46 ◽  
Author(s):  
PEDRO E.G. LOUREIRO ◽  
SANDRINE DUARTE ◽  
DMITRY V. EVTUGUIN ◽  
M. GRAÇA V.S. CARVALHO
Keyword(s):  
Hydrogen Peroxide ◽  
Copper Ions ◽  
Peroxide Bleaching ◽  
Metals Removal ◽  
Peroxide Decomposition ◽  
Equipment Corrosion ◽  
And Performance ◽  
And Control ◽  
Main Effects

This study puts particular emphasis on the role of copper ions in the performance of hydrogen peroxide bleaching (P-stage). Owing to their variable levels across the bleaching line due to washing filtrates, bleaching reagents, and equipment corrosion, these ions can play a major role in hydrogen peroxide decomposition and be detrimental to polysaccharide integrity. In this study, a Cu-contaminated D0(EOP)D1 prebleached pulp was subjected to an acidic washing (A-stage) or chelation (Q-stage) before the alkaline P-stage. The objective was to understand the isolated and combined role of copper ions in peroxide bleaching performance. By applying an experimental design, it was possible to identify the main effects of the pretreatment variables on the extent of metals removal and performance of the P-stage. The acid treatment was unsuccessful in terms of complete copper removal, magnesium preservation, and control of hydrogen peroxide consumption in the following P-stage. Increasing reaction temperature and time of the acidic A-stage improved the brightness stability of the D0(EOP)D1AP bleached pulp. The optimum conditions for chelation pretreatment to maximize the brightness gains obtained in the subsequent P-stage with the lowest peroxide consumption were 0.4% diethylenetriaminepentaacetic acid (DTPA), 80ºC, and 4.5 pH.

Heterogeneous Fenton Catalytic Removal of Organic Pollutant in Aqueous Solution by using Coal Gangue as a Catalyst

2019 ◽  
Vol 12 (4) ◽  
pp. 312-325
Author(s):  
Jiwei Zhang ◽  
Jingjing Xu ◽  
Shuaixia Liu ◽  
Baoxiang Gu ◽  
Feng Chen ◽  
...  
Keyword(s):  
Aqueous Solution ◽  
Hydrogen Peroxide ◽  
Hydroxyl Radical ◽  
Removal Rate ◽  
Organic Pollutant ◽  
Coal Gangue ◽  
Ion Leakage ◽  
Heterogeneous Fenton ◽  
Solution Ph ◽  
X Ray

Background: Coal gangue was used as a catalyst in heterogeneous Fenton process for the degradation of azo dye and phenol. The influencing factors, such as solution pH gangue concentration and hydrogen peroxide dosage were investigated, and the reaction mechanism between coal gangue and hydrogen peroxide was also discussed. Methods: Experimental results showed that coal gangue has the ability to activate hydrogen peroxide to degrade environmental pollutants in aqueous solution. Under optimal conditions, after 60 minutes of treatment, more than 90.57% of reactive red dye was removed, and the removal efficiency of Chemical Oxygen Demand (COD) up to 72.83%. Results: Both hydroxyl radical and superoxide radical anion participated in the degradation of organic pollutant but hydroxyl radical predominated. Stability tests for coal gangue were also carried out via the continuous degradation experiment and ion leakage analysis. After five times continuous degradation, dye removal rate decreased slightly and the leached Fe was still at very low level (2.24-3.02 mg L-1). The results of Scanning Electron Microscope (SEM), energy dispersive X-Ray Spectrometer (EDS) and X-Ray Powder Diffraction (XRD) indicated that coal gangue catalyst is stable after five times continuous reuse. Conclusion: The progress in this research suggested that coal gangue is a potential nature catalyst for the efficient degradation of organic pollutant in water and wastewater via the Fenton reaction.

scholarly journals Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers

2021 ◽  
Vol 11 (4) ◽  
pp. 1783
Author(s):  
Ming-Yi Tsai ◽  
Kun-Ying Li ◽  
Sun-Yu Ji
Keyword(s):  
Silicon Carbide ◽  
Wear Rate ◽  
Single Crystal ◽  
Traditional Method ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Diamond Grit ◽  
Ceramic Binder

In this study, special ceramic grinding plates impregnated with diamond grit and other abrasives, as well as self-made lapping plates, were used to prepare the surface of single-crystal silicon carbide (SiC) wafers. This novel approach enhanced the process and reduced the final chemical mechanical planarization (CMP) polishing time. Two different grinding plates with pads impregnated with mixed abrasives were prepared: one with self-modified diamond + SiC and a ceramic binder and one with self-modified diamond + SiO2 + Al2O3 + SiC and a ceramic binder. The surface properties and removal rate of the SiC substrate were investigated and a comparison with the traditional method was conducted. The experimental results showed that the material removal rate (MRR) was higher for the SiC substrate with the mixed abrasive lapping plate than for the traditional method. The grinding wear rate could be reduced by 31.6%. The surface roughness of the samples polished using the diamond-impregnated lapping plate was markedly better than that of the samples polished using the copper plate. However, while the surface finish was better and the grinding efficiency was high, the wear rate of the mixed abrasive-impregnated polishing plates was high. This was a clear indication that this novel method was effective and could be used for SiC grinding and lapping.

scholarly journals Adsorption of copper ions on Magnolia officinalis residues after solid-phase fermentation with Phanerochaete chrysosporium

2019 ◽  
Vol 17 (1) ◽  
pp. 1173-1184 ◽  
Author(s):  
Fengyun Tao ◽  
Yangping Liu ◽  
Junliang Chen ◽  
Peng Wang ◽  
Qing Huo
Keyword(s):  
Chinese Medicine ◽  
Phanerochaete Chrysosporium ◽  
Solid Phase ◽  
Copper Ions ◽  
Removal Rate ◽  
Low Cost ◽  
Preparation Technique ◽  
Adsorption Enthalpy ◽  
Pseudo Second Order ◽  
Magnolia Officinalis

AbstractThe disposal of residues while manufacturing Chinese medicine has always been an issue that concerns pharmaceutical factories. Phanerochaete chrysosporium was inoculated into the residues of Magnolia officinalis for solid-phase fermentation to enzymatically hydrolyze the lignin in the residues and thus to improve the efficiency of removal of the copper ions from residues for the utilization of residues from Chinese medicine. With the increase in activities of lignin-degrading enzymes, especially during the fermentation days 6 to 9, the removal rate of copper ions using M. officinalis residues increased dramatically. The rate of removal reached the maximum on the 14th day and was 3.15 times higher than the initial value. The rate of adsorption of copper ions on the fermentation-modified M. officinalis residues followed the pseudo-second-order kinetics. The adsorption isotherms were consistent with the Freundlich models. The adsorption enthalpy was positive, indicating that it was endothermic and elevation in temperature was favorable to this adsorption process. The adsorption free energy was negative, implying the spontaneity of the process. The copper ions adsorbed could be effectively recovered using 0.2 M hydrochloric acid solution. After five successive cycles of adsorption-regeneration, the fermentation-modified M. officinalis residues exhibited a stable adsorption capacity and greater reusability. The M. officinalis residues fermented with P. chrysosporium are low-cost and environmentally friendly copper ions adsorbent, and this preparation technique realizes the optimum utilization of Chinese medicine residues.

Derivation of Optimum Study Factors for Samples Contaminated with Cd Using Electric/Magnetic Field and ORP

2013 ◽  
Vol 813 ◽  
pp. 519-524
Author(s):  
Sang An Ha ◽  
Jei Pil Wang
Keyword(s):  
Magnetic Field ◽  
Heavy Metals ◽  
Removal Rate ◽  
Underground Water ◽  
Liquid Electrode ◽  
Oxidation Reduction ◽  
Oxidation Reduction Potential ◽  
Removal Of Heavy Metals ◽  
High Removal Rate ◽  
Membrane Treatment

A purpose of the present study is to derive optimum study factors for removal of heavy metals using combined alternating current electric/magnetic field and electric membranes for the area contaminated with heavy metals in soil or underground water. ORP (Oxidation Reduction Potential) analysis was conducted to determine an intensity of tendency for oxidation or reduction of the samples contaminated with heavy metals, and electrical membrane treatment was used with adjustment of concentrations and voltages of liquid electrode (Na2SO4) to derive a high removal rate. Removal constants were analyzed to be 0.0417, 0.119, 0.1594 when the voltages were 5V, 10V, 15V, respectively, and treatment efficiency was shown to increase as the liquid electrode concentration was increased. Keywords: heavy metals, electric/magnetic field, ORP, electrical membrane

Numerical Prediction of Contaminant Removal from Cavity in Horizontal Channel by Constrained Interpolated Profile Method

2014 ◽  
Vol 695 ◽  
pp. 384-388
Author(s):  
Nor Azwadi Che Sidik ◽  
A.S. Ahmad Sofianuddin ◽  
K.Y. Ahmat Rajab
Keyword(s):  
Reynolds Number ◽  
Aspect Ratio ◽  
Removal Rate ◽  
Contaminant Removal ◽  
Square Cavity ◽  
Profile Method ◽  
Aspect Ratios ◽  
Contaminants Removal ◽  
Parabolic Flow ◽  
High Removal Rate

In this paper, Constrained Interpolated Profile Method (CIP) was used to simulate contaminants removal from square cavity in channel flow. Predictions were conducted for the range of aspect ratios from 0.25 to 4.0. The inlet parabolic flow with various Reynolds number from 50 to 1000 was used for the whole presentation with the same properties of contaminants and fluid. The obtained results indicated that the percentage of removal increased at high aspect ratio of cavity and higher Reynolds number of flow but it shows more significant changes as increasing aspect ratio rather than increasing Reynolds number. High removal rate was found at the beginning of the removal process.

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