Thermal Characteristics of InP-Al2O3/Si Low Temperature Heterogeneous Direct Bonding for Photonic Device Integration
2013 ◽
Vol 2
(9)
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pp. N169-N174
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Keyword(s):
2012 ◽
Vol 159
(5)
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pp. H507-H510
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Keyword(s):
2003 ◽
Vol 97
(1)
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pp. 70-77
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1994 ◽
Vol 7
(3)
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pp. 132-139
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2001 ◽
Vol 21
(1)
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pp. 1-18
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Keyword(s):
2001 ◽
Vol 183
(6)
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pp. 1974-1982
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