An Analytical Model of Contact Pressure Caused by 2-D Wafer Topography in Chemical-Mechanical Polishing Process

Lixiao Wu

doi:10.1149/2.006203jss

An Analytical Model of Contact Pressure Caused by 2-D Wafer Topography in Chemical-Mechanical Polishing Process

ECS Journal of Solid State Science and Technology ◽

10.1149/2.006203jss ◽

2012 ◽

Vol 1 (3) ◽

pp. P133-P139 ◽

Cited By ~ 6

Author(s):

Lixiao Wu

Keyword(s):

Contact Pressure ◽

Analytical Model ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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An Analytical Model of Contact Pressure Caused by 2-D Wafer Topography in Chemical-Mechanical Polishing Process

ECS Transactions ◽

10.1149/1.3694378 ◽

2019 ◽

Vol 44 (1) ◽

pp. 621-628

Author(s):

Lixiao Wu

Keyword(s):

Contact Pressure ◽

Analytical Model ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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Effect of temperature on copper damascene chemical mechanical polishing process

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ◽

10.1116/1.2825143 ◽

2008 ◽

Vol 26 (1) ◽

pp. 141 ◽

Cited By ~ 13

Author(s):

Veera Raghava Kakireddy ◽

Subrahmanya Mudhivarthi ◽

Ashok Kumar

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Effect Of Temperature ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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Integrated Tungsten Chemical Mechanical Polishing Process Characterization for Via Plug Interconnection in Ultralarge Scale Integrated Circuits

Japanese Journal of Applied Physics ◽

10.1143/jjap.41.5120 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5120-5124 ◽

Cited By ~ 5

Author(s):

Chin-Kun Wang ◽

Hua-Shu Wu ◽

Nai-Tien Ou ◽

Huang-Chung Cheng

Keyword(s):

Integrated Circuits ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Process Characterization ◽

Chemical Mechanical Polishing Process

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Characterization of a New Cleaning Method Using Electrolytic Ionized Water for Polysilicon Chemical Mechanical Polishing Process

Japanese Journal of Applied Physics ◽

10.1143/jjap.41.5098 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5098-5103 ◽

Cited By ~ 6

Author(s):

Naoto Miyashita ◽

Shin-ichiro Uekusa ◽

Hiroshi Katumata

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Cleaning Method ◽

Chemical Mechanical Polishing Process

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Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-007-1124-7 ◽

2007 ◽

Vol 38 (7-8) ◽

pp. 674-682 ◽

Cited By ~ 36

Author(s):

Hsin-Te Liao ◽

Jie-Ren Shie ◽

Yung-Kuang Yang

Keyword(s):

Design Of Experiments ◽

Process Parameters ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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Ultrafiltration based on various polymeric membranes for recovery of spent tungsten slurry for reuse in chemical mechanical polishing process

Journal of Membrane Science ◽

10.1016/j.memsci.2017.11.034 ◽

2018 ◽

Vol 548 ◽

pp. 232-238 ◽

Cited By ~ 2

Author(s):

Nur Fatin Amalina Muhammad Sanusi ◽

Mohd Hizami Mohd Yusoff ◽

Ooi Boon Seng ◽

Mohd Sabirin Marzuki ◽

Ahmad Zuhairi Abdullah

Keyword(s):

Chemical Mechanical Polishing ◽

Polymeric Membranes ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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A Dynamic Thermal Modeling of Chemical Mechanical Polishing Process

Transactions of the Korean Society of Mechanical Engineers A ◽

10.3795/ksme-a.2004.28.5.617 ◽

2004 ◽

Vol 28 (5) ◽

pp. 617-623

Keyword(s):

Chemical Mechanical Polishing ◽

Thermal Modeling ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process

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Removal of scratch on the surface of MgO single crystal substrate in chemical mechanical polishing process

Applied Surface Science ◽

10.1016/j.apsusc.2008.01.150 ◽

2008 ◽

Vol 254 (15) ◽

pp. 4856-4863 ◽

Cited By ~ 11

Author(s):

R.K. Kang ◽

K. Wang ◽

J. Wang ◽

D.M. Guo

Keyword(s):

Single Crystal ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Single Crystal Substrate ◽

Polishing Process ◽

Crystal Substrate ◽

Chemical Mechanical Polishing Process

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Indium Tin Oxide Film Characteristics after Chemical Mechanical Polishing Process with Control of Pad Conditioning Temperature

Solid State Phenomena - Advances in Nanomaterials and Processing ◽

10.4028/3-908451-31-0.263 ◽

2007 ◽

pp. 263-266

Author(s):

Nam Hoon Kim ◽

Gwon Woo Choi ◽

Yong Jin Seo ◽

Woo Sun Lee

Keyword(s):

Oxide Film ◽

Tin Oxide ◽

Indium Tin Oxide ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Conditioning Temperature ◽

Chemical Mechanical Polishing Process ◽

Pad Conditioning ◽

Film Characteristics

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3-D Model of Wafer Topography's Effect on Chemical Mechanical Polishing Process

ECS Meeting Abstracts ◽

10.1149/ma2009-02/22/1992 ◽

2009 ◽

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process ◽

D Model

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