scholarly journals Preparation of Solid Electrolyte Thin Films for Relaxing Thermal Stresses

1993 ◽  
Vol 1993-4 (1) ◽  
pp. 74-81
Author(s):  
Kazuo Tomida
Keyword(s):  
Thin Films ◽  
Solid Electrolyte ◽  
Thermal Stresses

An Impedancemetric Micro NO2 Sensor Using Oxide and Solid-Electrolyte Thin-Films

2020 ◽  
Vol 140 (11) ◽  
pp. 305-308
Author(s):  
Tsuyoshi Sakai ◽  
Satoko Takase ◽  
Youichi Shimizu
Keyword(s):  
Thin Films ◽  
Solid Electrolyte

scholarly journals Nanostructured Pr-doped Ceria (PCO) thin films as sensing electrodes in solid-electrolyte type gas sensors with enhanced toluene sensitivity

2020 ◽  
Vol 317 ◽  
pp. 128037 ◽  
Author(s):  
Taro Ueda ◽  
Thomas Defferriere ◽  
Takeo Hyodo ◽  
Yasuhiro Shimizu ◽  
Harry L. Tuller
Keyword(s):  
Thin Films ◽  
Solid Electrolyte ◽  
Gas Sensors ◽  
Doped Ceria

Analysis of damage formation and propagation in metallic thin films under the action of thermal stresses and electric fields

1996 ◽  
Vol 2 (3) ◽  
pp. 231-258 ◽  
Author(s):  
Dimitrios Maroudas ◽  
Matthew N. Enmark ◽  
Cora M. Leibig ◽  
Sokrates T. Pantelides
Keyword(s):  
Thin Films ◽  
Electric Fields ◽  
Thermal Stresses ◽  
Metallic Thin Films

scholarly journals Bulk-type All-solid-state Lithium Secondary Batteries Using Highly Ion-conductive Sulfide Solid Electrolyte Thin Films

2014 ◽  
Vol 82 (7) ◽  
pp. 591-594 ◽  
Author(s):  
Yusuke ITO ◽  
Atsushi SAKUDA ◽  
Takamasa OHTOMO ◽  
Akitoshi HAYASHI ◽  
Masahiro TATSUMISAGO
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Solid Electrolyte ◽  
Lithium Secondary Batteries

New amorphous thin films of lithium ion conductive solid electrolyte

1983 ◽  
Vol 9-10 ◽  
pp. 1469-1472 ◽  
Author(s):  
Katsuki Miyauchi ◽  
Kazunobu Matsumoto ◽  
Keiichi Kanehori ◽  
Tetsuichi Kudo
Keyword(s):  
Thin Films ◽  
Solid Electrolyte ◽  
Lithium Ion ◽  
Amorphous Thin Films

scholarly journals Dislocation Plasticity and Detwinning Under Thermal Stresses in Nanotwinned Ag Thin Films

2020 ◽  
Author(s):  
Maya K. Kini ◽  
Claudia Merola ◽  
Benjamin Breitbach ◽  
Dennis Klapproth ◽  
Bastian Philippi ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stresses ◽  
Dislocation Plasticity

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

2009 ◽  
Author(s):  
Khalid Alzoubi ◽  
Susan Lu ◽  
Bahgat Sammakia ◽  
Mark Poliks
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Polyethylene Terephthalate ◽  
Flexible Electronics ◽  
Electrical Resistance ◽  
Thermal Stresses ◽  
Electronic Systems ◽  
Total Width ◽  
Flexible Substrates ◽  
Polyethylene Naphthalate

Flexible electronics represent an emerging area in the electronics packaging and systems integration industry with the potential for new product development and commercialization in the near future. Manufacturing electronics on flexible substrates will produce low cost devices that are rugged, light, and flexible. However, electronic systems are vulnerable to failures caused by mechanical and thermal stresses. For electronic systems on flexible substrates repeated stresses below the ultimate tensile strength or even below the yield strength will cause failures in the thin films. It is known that mechanical properties of thin films are different from those of bulk materials; so, it is difficult to extrapolate bulk material properties on thin film materials. The objective of this work is to study the behavior of thin-film metal coated flexible substrates under high cyclic bending fatigue loading. Polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are widely used substrates in the fabrication of microelectronic devices. Factors affecting the fatigue life of thin-film coated flexible substrates were studied, including thin film thickness, temperature, and humidity. A series of experiments for sputter-deposited copper on PET substrates were performed. Electrical resistance and crack growth rate were monitored during the experiments at specified time intervals. High magnification images were obtained to observe the crack initiation and propagation in the metal film. Statistical analysis based on design of experiments concepts was performed to identify the main factors and factor’s interaction that affect the life of a thin-film coated substrate. The results of the experiments showed that the crack starts in the middle of the sample and slowly grows toward the edges. Electrical resistance increases slightly during the test until the crack length covers about 90% of the total width of the sample where a dramatic increase in the resistance takes place.

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