Hydrophobic Modification of Diamond Conditioner for Prevention of Particle Adhesion During Oxide CMP

2011 ◽  
Vol 158 (9) ◽  
pp. H941
Author(s):  
In-Kwon Kim ◽  
Tae-Young Kwon ◽  
Dong-Chan Kim ◽  
Moon-Seak Park ◽  
Jin-Goo Park
Keyword(s):  
Particle Adhesion ◽  
Hydrophobic Modification ◽  
Diamond Conditioner

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

Hydrophobic modification of fir wood surface via low ppm ATRP strategy

Polymer ◽  
2021 ◽  
pp. 123942
Author(s):  
I. Zaborniak ◽  
A. Macior ◽  
P. Chmielarz ◽  
J. Smenda ◽  
K. Wolski
Keyword(s):  
Wood Surface ◽  
Hydrophobic Modification

An efficient hydrophobic modification of TS-1 and its application in the epoxidation of propylene

2019 ◽  
Vol 43 (26) ◽  
pp. 10390-10397 ◽  
Author(s):  
Baohe Wang ◽  
Huanhuan Han ◽  
Baomin Ge ◽  
Jing Ma ◽  
Jing Zhu ◽  
...  
Keyword(s):  
Hydrophobic Modification ◽  
Epoxidation Of Propylene ◽  
Product Generation ◽  
Precursor Modification

Hydrophobic TS-1 was synthesized through resole resin precursor modification. Hydrophobic TS-1 can avoid by-product generation.

Graphite Particle Adhesion to Hastelloy X: Measurements of the Adhesive Force with an Atomic Force Microscope

2014 ◽  
Vol 186 (1) ◽  
pp. 45-59 ◽  
Author(s):  
Naphtali M. Mokgalapa ◽  
Tushar K. Ghosh ◽  
Sudarshan K. Loyalka
Keyword(s):  
Atomic Force Microscope ◽  
Graphite Particle ◽  
Adhesive Force ◽  
Particle Adhesion ◽  
Hastelloy X ◽  
Atomic Force

Super-hydrophobic modification of porous natural polymer “luffa sponge” for oil absorption

Polymer ◽  
2017 ◽  
Vol 126 ◽  
pp. 470-476 ◽  
Author(s):  
Zhe Wang ◽  
Hongyang Ma ◽  
Benjamin Chu ◽  
Benjamin S. Hsiao
Keyword(s):  
Oil Absorption ◽  
Natural Polymer ◽  
Hydrophobic Modification ◽  
Luffa Sponge

Molecular Dynamic Modeling of Particle Adhesion

1995 ◽  
Vol 51 (1-4) ◽  
pp. 49-69 ◽  
Author(s):  
D. J. Quesnel ◽  
D. S. Rimai ◽  
L. P. Demejo
Keyword(s):  
Molecular Dynamic ◽  
Dynamic Modeling ◽  
Particle Adhesion ◽  
Molecular Dynamic Modeling

Simulation Research on Control Technology of Micro-Particle Adhesion to Surface

2011 ◽  
Vol 181-182 ◽  
pp. 366-371
Author(s):  
Hui Liu ◽  
Yan Qiang Li
Keyword(s):  
Numerical Simulation ◽  
Electrostatic Force ◽  
Actual State ◽  
Control Technology ◽  
Particle Adhesion ◽  
Adhesion Mechanism ◽  
Simulation Research ◽  
Mechanical Models ◽  
Analysis Of Results ◽  
Simulation Package

The micro particle brings much harm to some industrials, agriculture and human activities. The mechanical models of micro particle adhesion to the surface and the control, disposal technology have become very important for prevention from particle aggradations. For the sake of deeply comprehending and researching the adhesion mechanism as well as kinematics characteristic, numerical simulation of particle adhesion was made based on compute simulation package, the analysis of results and relevant comparison demonstrate that it can well simulate actual state and the results of simulation show that the capillary force (Fc) is the biggest, by contrast, the electrostatic force (Fes) is the smallest. Further more, it has some valuable instructions and helpful references for control of micro-particle adhesion to surface. At last, the outlook of issue was put forward.

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