Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement

2011 ◽  
Vol 158 (9) ◽  
pp. D541 ◽  
Author(s):  
Kyung Ju Park ◽  
Hyo-Chol Koo ◽  
Taeho Lim ◽  
Myung Jun Kim ◽  
Oh Joong Kwon ◽  
...  
Keyword(s):  
Electroless Deposition

In Situ Electrochemical Study of Copper Nanoparticles Stabilized with Food Grade Gelatin

2016 ◽  
Vol 705 ◽  
pp. 163-167 ◽  
Author(s):  
Ellaine M. Datu ◽  
Mary Donnabelle L. Balela
Keyword(s):  
Electroless Deposition ◽  
Reduction Rate ◽  
In Situ Monitoring ◽  
Mixed Potential ◽  
Cu Nanoparticles ◽  
Environment Friendly ◽  
Food Grade ◽  
Alternative Material ◽  
Kinetics Of

Commercially available conductive inks are typically made up of precious metal nanoparticles, such as gold (Au) and silver (Ag). Thus, cheaper metals like copper (Cu) are currently being explored as alternative material. Though Cu has a comparable conductivity to that of Ag, they tend to oxidize easily when exposed to air and water, which could limit their application. In this work, oxidation-stable Cu nanoparticles with mean diameter as small as 57 nm were prepared by simple electroless deposition in water. Food-grade gelatin was used as stabilizer, which makes the process more economical and environment-friendly. In situ monitoring of mixed potential was carried out during synthesis to understand the kinetics of the reaction. The mixed potential of the solution shifted negatively as the amount of gelatin was increased. This suggests faster reduction rate.

scholarly journals Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer-Assisted Electroless Deposition

2016 ◽  
Vol 4 (2) ◽  
pp. 1600313 ◽  
Author(s):  
Suqing Liang ◽  
Yaoyao Li ◽  
Tingjiao Zhou ◽  
Jinbin Yang ◽  
Xiaohu Zhou ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Metal Structures ◽  
Microfluidic Patterning

scholarly journals In Situ Construction of Ag/Ni(OH)2 Composite Electrode by Combining Electroless Deposition Technology with Electrodeposition

Metals ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 826
Author(s):  
Sa Lv ◽  
Fan Yang ◽  
Xuefeng Chu ◽  
Huan Wang ◽  
Jia Yang ◽  
...  
Keyword(s):  
Electrochemical Properties ◽  
Electroless Deposition ◽  
Composite Electrode ◽  
Coulombic Efficiency ◽  
Copper Substrate ◽  
High Specific Capacitance ◽  
Growth Strategy ◽  
Equivalent Series Resistance ◽  
Deposition Technology

The Ag/Ni(OH)2 composite electrode has been designed and in situ constructed on a copper substrate by combining electroless deposition technology with electrodeposition. The products can be directly used as a high performance binder free electrode. The synergistic effect between the Ag nanocubes (AgNCs) as backbones and the deposited Ni(OH)2 as the shell can significantly improve the electrochemical properties of the composite electrode. Moreover, this in situ growth strategy forms a strong bonding force of active materials to the substrate, which can improve the cycling performance and lower the equivalent series resistance. The Ag/Ni(OH)2 composite electrode exhibits enhanced electrochemical properties with a high specific capacitance of 3.704 F cm−2, coulombic efficiency of 88.3% and long-term cyclic stability.

Evaluation of Stability and Reactivity of Solutions by In Situ Transmittance in Electroless Deposition

2019 ◽  
Vol 25 (38) ◽  
pp. 145-153
Author(s):  
Kyung Ju Park ◽  
Hyo-Chol Koo ◽  
Taeho Lim ◽  
Jae Jeong Kim
Keyword(s):  
Electroless Deposition

Direct surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film

2019 ◽  
Vol 97 ◽  
pp. 450-457 ◽  
Author(s):  
Yuefeng Wang ◽  
Yan Hong ◽  
Qingguo Chen ◽  
Guoyun Zhou ◽  
Wei He ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Polyimide Film ◽  
In Situ Activation

Effect of PVP on the Morphology and Growth of Cu Hierarchical Nanostructures Prepared by Electroless Deposition

2019 ◽  
Vol 821 ◽  
pp. 183-188
Author(s):  
Mary Donnabelle L. Balela ◽  
Vina Ingrid Cabiles
Keyword(s):  
Electroless Deposition ◽  
Reduction Rate ◽  
Particle Diameter ◽  
The Other ◽  
Mixed Potential ◽  
Cu Nanoparticles ◽  
Structure Directing Agent ◽  
Hierarchical Nanostructures ◽  
Mean Particle Diameter

Octahedral Cu hierarchical nanostructures were prepared by electroless deposition in aqueous solution at 80 °C. Polyvinyl pyrrolidone (PVP) was employed as the protective and structure directing agent to prevent oxidation and agglomeration of the Cu products. Addition of higher amounts of PVP (about 1.275 g) resulted in smaller but irregularly-shaped Cu nanoparticles. The Cu nanoparticles have a mean particle diameter of about 200 nm with excellent size distribution. On the other hand, Cu octahedrals were produced when 0.425 to 0.850 g PVP was used. In situ mixed potential monitoring of the solution during electroless deposition revealed that the mixed potential was more positive at larger amounts of PVP. This can be attributed to slower reduction rate due to the decrease in the activity of Cu(II) ions. Consequently, smaller Cu nanoparticles were produced.

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