scholarly journals Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer-Assisted Electroless Deposition

2016 ◽  
Vol 4 (2) ◽  
pp. 1600313 ◽  
Author(s):  
Suqing Liang ◽  
Yaoyao Li ◽  
Tingjiao Zhou ◽  
Jinbin Yang ◽  
Xiaohu Zhou ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Metal Structures ◽  
Microfluidic Patterning

In Situ Electrochemical Study of Copper Nanoparticles Stabilized with Food Grade Gelatin

2016 ◽  
Vol 705 ◽  
pp. 163-167 ◽  
Author(s):  
Ellaine M. Datu ◽  
Mary Donnabelle L. Balela
Keyword(s):  
Electroless Deposition ◽  
Reduction Rate ◽  
In Situ Monitoring ◽  
Mixed Potential ◽  
Cu Nanoparticles ◽  
Environment Friendly ◽  
Food Grade ◽  
Alternative Material ◽  
Kinetics Of

Commercially available conductive inks are typically made up of precious metal nanoparticles, such as gold (Au) and silver (Ag). Thus, cheaper metals like copper (Cu) are currently being explored as alternative material. Though Cu has a comparable conductivity to that of Ag, they tend to oxidize easily when exposed to air and water, which could limit their application. In this work, oxidation-stable Cu nanoparticles with mean diameter as small as 57 nm were prepared by simple electroless deposition in water. Food-grade gelatin was used as stabilizer, which makes the process more economical and environment-friendly. In situ monitoring of mixed potential was carried out during synthesis to understand the kinetics of the reaction. The mixed potential of the solution shifted negatively as the amount of gelatin was increased. This suggests faster reduction rate.

scholarly journals In Situ Construction of Ag/Ni(OH)2 Composite Electrode by Combining Electroless Deposition Technology with Electrodeposition

Metals ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 826
Author(s):  
Sa Lv ◽  
Fan Yang ◽  
Xuefeng Chu ◽  
Huan Wang ◽  
Jia Yang ◽  
...  
Keyword(s):  
Electrochemical Properties ◽  
Electroless Deposition ◽  
Composite Electrode ◽  
Coulombic Efficiency ◽  
Copper Substrate ◽  
High Specific Capacitance ◽  
Growth Strategy ◽  
Equivalent Series Resistance ◽  
Deposition Technology

The Ag/Ni(OH)2 composite electrode has been designed and in situ constructed on a copper substrate by combining electroless deposition technology with electrodeposition. The products can be directly used as a high performance binder free electrode. The synergistic effect between the Ag nanocubes (AgNCs) as backbones and the deposited Ni(OH)2 as the shell can significantly improve the electrochemical properties of the composite electrode. Moreover, this in situ growth strategy forms a strong bonding force of active materials to the substrate, which can improve the cycling performance and lower the equivalent series resistance. The Ag/Ni(OH)2 composite electrode exhibits enhanced electrochemical properties with a high specific capacitance of 3.704 F cm−2, coulombic efficiency of 88.3% and long-term cyclic stability.

Evaluation of Stability and Reactivity of Solutions by In Situ Transmittance in Electroless Deposition

2019 ◽  
Vol 25 (38) ◽  
pp. 145-153
Author(s):  
Kyung Ju Park ◽  
Hyo-Chol Koo ◽  
Taeho Lim ◽  
Jae Jeong Kim
Keyword(s):  
Electroless Deposition

Direct surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film

2019 ◽  
Vol 97 ◽  
pp. 450-457 ◽  
Author(s):  
Yuefeng Wang ◽  
Yan Hong ◽  
Qingguo Chen ◽  
Guoyun Zhou ◽  
Wei He ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Polyimide Film ◽  
In Situ Activation

Micro Thin Film Temperature Sensors Embedded in Metal Structures

2004 ◽  
Author(s):  
Hongseok Choi ◽  
Arindom Datta ◽  
Xiaochun Li
Keyword(s):  
Thin Film ◽  
Chemical Vapor ◽  
Temperature Sensors ◽  
In Situ Monitoring ◽  
Manufacturing Processes ◽  
Metal Structures ◽  
Thin Film Sensors ◽  
Thin Film Thermocouple ◽  
Thin Film Thermocouples

This paper studies the fabrication and calibration of thin film temperature sensors embedded in metal structures. Thin film thermocouples have been successfully fabricated on various metal substrates and advanced embedding techniques have been developed to ensure sensor function inside metal structures. Thin film thermocouple was insulated with multiple thin film layers (Al2O3 and Si3N4) by e-beam evaporating and plasma enhanced chemical vapor deposition (PECVD). The sensors are calibrated. These embedded thin film sensors provide superior spatial and temporal resolution that is not possible with traditional sensors used in various manufacturing processes. This research is significant in a way that it provides a new and improved route for in-situ monitoring of manufacturing process.

Effect of PVP on the Morphology and Growth of Cu Hierarchical Nanostructures Prepared by Electroless Deposition

2019 ◽  
Vol 821 ◽  
pp. 183-188
Author(s):  
Mary Donnabelle L. Balela ◽  
Vina Ingrid Cabiles
Keyword(s):  
Electroless Deposition ◽  
Reduction Rate ◽  
Particle Diameter ◽  
The Other ◽  
Mixed Potential ◽  
Cu Nanoparticles ◽  
Structure Directing Agent ◽  
Hierarchical Nanostructures ◽  
Mean Particle Diameter

Octahedral Cu hierarchical nanostructures were prepared by electroless deposition in aqueous solution at 80 °C. Polyvinyl pyrrolidone (PVP) was employed as the protective and structure directing agent to prevent oxidation and agglomeration of the Cu products. Addition of higher amounts of PVP (about 1.275 g) resulted in smaller but irregularly-shaped Cu nanoparticles. The Cu nanoparticles have a mean particle diameter of about 200 nm with excellent size distribution. On the other hand, Cu octahedrals were produced when 0.425 to 0.850 g PVP was used. In situ mixed potential monitoring of the solution during electroless deposition revealed that the mixed potential was more positive at larger amounts of PVP. This can be attributed to slower reduction rate due to the decrease in the activity of Cu(II) ions. Consequently, smaller Cu nanoparticles were produced.

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