Electrodeposition of Semiconductor n-CdTe and p-CdTe in Aqueous Medium and Aluminum Metal in a Nonaqueous Medium

2019 ◽  
Vol 33 (18) ◽  
pp. 81-90 ◽  
Author(s):  
Brian Ashead ◽  
Shahed U. Khan
2005 ◽  
Vol 123 ◽  
pp. 341-344
Author(s):  
A. Khaldoun ◽  
F. González-Caballero ◽  
J. G. López-Durán ◽  
N. Mahrach ◽  
M. L. Kerkeb

2017 ◽  
Vol 39 (1) ◽  
pp. 46-52
Author(s):  
T. SAVCHENKO ◽  
◽  
A. GRECHANOVSKY ◽  
A. BRIK ◽  
N. DUDCHENKO

2019 ◽  
Author(s):  
Chem Int

The removal of Cd(II) and Pb(II) ions from aqueous medium was studied using potato peels biomass. The adsorption process was evaluated using Atomic Absorption Spectrophotometer (AAS). The Vibrational band of the potato peels was studied using Fourier Transform Infrared Spectroscopy (FTIR). The adsorption process was carried out with respect to concentration, time, pH, particle size and the thermodynamic evaluation of the process was carried at temperatures of 30, 40, 50 and 60(0C), respectively. The FTIR studies revealed that the potato peels was composed of –OH, -NH, –C=N, –C=C and –C-O-C functional groups. The optimum removal was obtained at pH 8 and contact time of 20 min. The adsorption process followed Freundlich adsorption and pseudo second-order kinetic models with correlation coefficients (R2) greater than 0.900. The equilibrium adsorption capacity showed that Pb(II) ion was more adsorbed on the surface of the potato peels biomass versus Cd (II) ion (200.91 mg/g > 125.00 mg/g). The thermodynamic studies indicated endothermic, dissociative mechanism and spontaneous adsorption process. This study shows that sweet potato peels is useful as a low-cost adsorbent for the removal of Cd(II) and Pb(II) ions from aqueous medium.


Author(s):  
Chunyu Zhang ◽  
Lakshmi Vedula ◽  
Shekhar Khandekar

Abstract Latch-up induced during High Temperature Operating Life (HTOL) test of a mixed signal device fabricated with 1.0 μm CMOS, double poly, double metal process caused failures due to an open in aluminum metal line. Metal lines revealed wedge voids of about 50% of the line width. Triggering of latch up mechanism during the HTOL test resulted in a several fold increase of current flowing through the ground metal line. This increase in current resulted in the growth of the wedge voids leading to failures due to open metal lines.


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