Atomic-Layer-Deposited Dielectric Thin Films on a Cu Clad Laminate Substrate for Embedded Metal–Insulator–Metal Capacitor Applications in Printed Circuit Boards

2011 ◽  
Vol 158 (1) ◽  
pp. G1 ◽  
Author(s):  
Tae Joo Park ◽  
Jeong Hwan Kim ◽  
Jae Hyuck Jang ◽  
Cheol Seong Hwang ◽  
Hyung-Dong Kang ◽  
...  
Keyword(s):  
Thin Films ◽  
Printed Circuit Boards ◽  
Atomic Layer ◽  
Circuit Boards ◽  
Metal Insulator ◽  
Dielectric Thin Films ◽  
Printed Circuit ◽  
Metal Insulator Metal

Comparison of Multilayer Dielectric Thin Films for Future Metal–Insulator–Metal Capacitors: Al2O3/HfO2/Al2O3versus SiO2/HfO2/SiO2

2011 ◽  
Vol 50 (10S) ◽  
pp. 10PB06 ◽  
Author(s):  
Sang-Uk Park ◽  
Hyuk-Min Kwon ◽  
In-Shik Han ◽  
Yi-Jung Jung ◽  
Ho-Young Kwak ◽  
...  
Keyword(s):  
Thin Films ◽  
Metal Insulator ◽  
Dielectric Thin Films ◽  
Metal Insulator Metal ◽  
Multilayer Dielectric

Temperature Dependence of Stress for Copper, Copper-Silver and Copper-Tin Films

1990 ◽  
Vol 188 ◽  
Author(s):  
Richard Haynes
Keyword(s):  
Thin Films ◽  
Thermal Cycling ◽  
Temperature Dependence ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Thermally Induced ◽  
Tin Alloys ◽  
Tin Films ◽  
Printed Circuit ◽  
Induced Stress

1. IntroductionIn VLSI processing and other applications such as printed circuit boards thin films of copper, usually used as conductors, undergo thermal cycling. This thermal cycling can cause loss of adhesion and mechanical failures thus decreasing reliability of the devices[l–7]. Understanding thermally induced stress due to mismatch of thermal expansion may assist in generating designs, processes and material replacement for increased reliability. This paper reports studies of the temperature dependence of stresses for plated and sputtered copper and plated copper-silver and copper-tin alloys. Studies of thermally annealed plated copper and copper-tin alloys are also reported.

Hydrothermal growth of BaTiO3 thin films on printed circuit boards for integral capacitor applications

2006 ◽  
Vol 16 (4) ◽  
pp. 581-585 ◽  
Author(s):  
C. K. Tan ◽  
Gregory K. L. Goh ◽  
D. Z. Chi ◽  
Albert C. W. Lu ◽  
B. K. Lok
Keyword(s):  
Thin Films ◽  
Printed Circuit Boards ◽  
Hydrothermal Growth ◽  
Circuit Boards ◽  
Printed Circuit
Sign in / Sign up

Export Citation Format

Share Document