Improved Shielding Performance Using High Permeability Electroplated Thin Films in Printed Circuit Boards

2011 ◽  
Vol 47 (10) ◽  
pp. 4282-4285 ◽  
Author(s):  
Maeve Duffy ◽  
Santosh Kulkarni ◽  
Saibal Roy
Keyword(s):  
Thin Films ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
High Permeability ◽  
Printed Circuit

Temperature Dependence of Stress for Copper, Copper-Silver and Copper-Tin Films

1990 ◽  
Vol 188 ◽  
Author(s):  
Richard Haynes
Keyword(s):  
Thin Films ◽  
Thermal Cycling ◽  
Temperature Dependence ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Thermally Induced ◽  
Tin Alloys ◽  
Tin Films ◽  
Printed Circuit ◽  
Induced Stress

1. IntroductionIn VLSI processing and other applications such as printed circuit boards thin films of copper, usually used as conductors, undergo thermal cycling. This thermal cycling can cause loss of adhesion and mechanical failures thus decreasing reliability of the devices[l–7]. Understanding thermally induced stress due to mismatch of thermal expansion may assist in generating designs, processes and material replacement for increased reliability. This paper reports studies of the temperature dependence of stresses for plated and sputtered copper and plated copper-silver and copper-tin alloys. Studies of thermally annealed plated copper and copper-tin alloys are also reported.

Hydrothermal growth of BaTiO3 thin films on printed circuit boards for integral capacitor applications

2006 ◽  
Vol 16 (4) ◽  
pp. 581-585 ◽  
Author(s):  
C. K. Tan ◽  
Gregory K. L. Goh ◽  
D. Z. Chi ◽  
Albert C. W. Lu ◽  
B. K. Lok
Keyword(s):  
Thin Films ◽  
Printed Circuit Boards ◽  
Hydrothermal Growth ◽  
Circuit Boards ◽  
Printed Circuit

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics
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