(Invited) Room Temperature Bonding of Wafers with Thin Nanocrystalline Metal Films

2019 ◽  
Vol 33 (4) ◽  
pp. 61-72 ◽  
Author(s):  
Takehito Shimatsu ◽  
Miyuki Uomoto
2002 ◽  
Vol 8 (S02) ◽  
pp. 1120-1121 ◽  
Author(s):  
Fengting Xu ◽  
Long Li ◽  
Judith C. Yang ◽  
Shane C. Street ◽  
John A. Barnard

2007 ◽  
Vol 55 (3) ◽  
pp. 777-784 ◽  
Author(s):  
N.R. Shamsutdinov ◽  
A.J. Böttger ◽  
B.J. Thijsse

2013 ◽  
Vol 112 ◽  
pp. 52-56 ◽  
Author(s):  
Yuichi Kurashima ◽  
Atsuhiko Maeda ◽  
Ryo Takigawa ◽  
Hideki Takagi

1990 ◽  
Vol 206 ◽  
Author(s):  
A. Ramachandra ◽  
M. Vaziri ◽  
R.P. Andres

ABSTRACTGold clusters (diam. = 1.0 ± .5 nm) are prepared in a gas aggregation source (MECS), expanded into a vacuum chamber to form a neutral cluster beam, and deposited at low impact velocity on room temperature substrates. When several monolayers of these clusters are deposited on clean substrates (nitrocellulose, glass, mica, NaCl), they form smooth ultra-thin films. These cluster-assembled films appear to be similar in quality to those produced by the Takagi-Yamada ion cluster beam process. They exhibit finite electrical conductivity at thicknesses much smaller than is the case with atomically evaporated films. They are extremely uniform and smooth with a surface height that typically varies less than 1 nm across the entire film.


Materia Japan ◽  
2010 ◽  
Vol 49 (11) ◽  
pp. 521-527 ◽  
Author(s):  
Takehito Shimatsu ◽  
Miyuki Uomoto

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