MEMS-based testing stage to study electrical and mechanical properties of nanocrystalline metal films

2007 ◽  
Author(s):  
Jong H. Han ◽  
Jagannathan Rajagopalan ◽  
M. Taher A. Saif
Keyword(s):  
Mechanical Properties ◽  
Metal Films ◽  
Nanocrystalline Metal ◽  
Testing Stage

scholarly journals Enhanced Quality Nanocrystalline Metal Films Produced By Dendrimer Mediated Thin Film Growth

2002 ◽  
Vol 8 (S02) ◽  
pp. 1120-1121 ◽  
Author(s):  
Fengting Xu ◽  
Long Li ◽  
Judith C. Yang ◽  
Shane C. Street ◽  
John A. Barnard
Keyword(s):  
Thin Film ◽  
Film Growth ◽  
Metal Films ◽  
Thin Film Growth ◽  
Nanocrystalline Metal

Characteristic mechanical properties and complex ordered structures in metal films on liquid substrates

2006 ◽  
Vol 51 (9) ◽  
pp. 1039-1049 ◽  
Author(s):  
Senjiang Yu ◽  
Yongju Zhang ◽  
Liangneng Wu ◽  
Yujian Cui ◽  
Hongliang Ge
Keyword(s):  
Mechanical Properties ◽  
Metal Films ◽  
Ordered Structures

MECHANICAL PROPERTIES OF NANOSTRUCTURED AMORPHOUS CARBON-METAL FILMS

2003 ◽  
Author(s):  
V. V. UGLOV ◽  
Y. PAULEAU ◽  
F. THIERY ◽  
J. PELLETIER ◽  
V. M. ANISHCHIK ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Amorphous Carbon ◽  
Metal Films

Grain coalescence and its effect on stress and elasticity in nanocrystalline metal films

2007 ◽  
Vol 55 (3) ◽  
pp. 777-784 ◽  
Author(s):  
N.R. Shamsutdinov ◽  
A.J. Böttger ◽  
B.J. Thijsse
Keyword(s):  
Metal Films ◽  
Nanocrystalline Metal ◽  
Grain Coalescence

Measurement of adhesion of thin films

1960 ◽  
Vol 254 (1277) ◽  
pp. 163-176 ◽  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Critical Load ◽  
Film Surface ◽  
Metal Films ◽  
Shearing Force ◽  
Absolute Value ◽  
Smooth Contour ◽  
Tip Radius ◽  
Clear Channel

Methods of measuring adhesion are considered and an analysis is presented of a method which is particularly suitable for thin films. In this method a rounded steel point of smooth contour is drawn across the film surface and the load on the point is gradually increased until the film is removed, leaving a clear channel. It is shown experimentally that the load required depends upon the nature of the interface between film and substrate without being directly dependent upon the mechanical properties of either. The method is analyzed in detail and a suitable mechanism is proposed. This mechanism is examined both theoretically and experimentally and it is shown that an absolute value of the shearing force required to remove a film can be calculated from the critical load required, the tip radius of the point and the identation hardness of the substrate. Applications have been restricted so far to metal films on transparent substrates.

scholarly journals Atomic Diffusion Bonding with Thin Nanocrystalline Metal Films

Materia Japan ◽  
2010 ◽  
Vol 49 (11) ◽  
pp. 521-527 ◽  
Author(s):  
Takehito Shimatsu ◽  
Miyuki Uomoto
Keyword(s):  
Diffusion Bonding ◽  
Metal Films ◽  
Atomic Diffusion ◽  
Nanocrystalline Metal
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