Cu/Low-k Thickness Measurement for Advanced Cu CMP Process Development and Control

2019 ◽  
Vol 18 (1) ◽  
pp. 453-458
Author(s):  
Yunlong Li ◽  
Nancy Heylen ◽  
Tinne Delande ◽  
Kristof Kellens ◽  
Patrick Ong ◽  
...  
Keyword(s):  
Process Development ◽  
Thickness Measurement ◽  
And Control ◽  
Cu Cmp ◽  
Low K

Application of EDS Technique for OSP Film Thickness Measurement

2006 ◽  
Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti
Keyword(s):  
Thin Film ◽  
Quantitative Analysis ◽  
Joint Strength ◽  
Critical Factor ◽  
Thickness Measurement ◽  
Ic Manufacturing ◽  
And Control ◽  
Film Thickness Measurement ◽  
Non Destructive

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.

Miniature Bioreactors for Rapid Bioprocess Development of Mammalian Cell Culture

2012 ◽  
Vol 59 (1) ◽  
Author(s):  
Mohd Helmi Sani ◽  
Frank Baganz
Keyword(s):  
Cell Culture ◽  
Mammalian Cell ◽  
Process Development ◽  
Mammalian Cell Culture ◽  
Small Scale ◽  
Cell Culture Process ◽  
Deep Wells ◽  
Working Volume ◽  
Culture Process ◽  
And Control

At present, there are a number of commercial small scale shaken systems available on the market with instrumented controllable microbioreactors such as Micro–24 Microreactor System (Pall Corporation, Port Washington, NY) and M2P Biolector, (M2P Labs GmbH, Aachen, Germany). The Micro–24 system is basically an orbital shaken 24–well plate that operates at working volume 3 – 7 mL with 24 independent reactors (deep wells, shaken and sparged) running simultaneously. Each reactor is designed as single use reactor that has the ability to continuously monitor and control the pH, DO and temperature. The reactor aeration is supplied by sparging air from gas feeds that can be controlled individually. Furthermore, pH can be controlled by gas sparging using either dilute ammonia or carbon dioxide directly into the culture medium through a membrane at the bottom of each reactor. Chen et al., (2009) evaluated the Micro–24 system for the mammalian cell culture process development and found the Micro–24 system is suitable as scaledown tool for cell culture application. The result showed that intra-well reproducibility, cell growth, metabolites profiles and protein titres were scalable with 2 L bioreactors.

scholarly journals VectorMOD: Method for Bottom-Up Proteomic Characterization of rAAV Capsid Post-Translational Modifications and Vector Impurities

2021 ◽  
Vol 12 ◽  
Author(s):  
Neil G. Rumachik ◽  
Stacy A. Malaker ◽  
Nicole K. Paulk
Keyword(s):  
Mass Spectrometry ◽  
Process Development ◽  
Cell Protein ◽  
Macromolecular Complex ◽  
Bottom Up ◽  
Post Translational Modifications ◽  
Simple Step ◽  
Product And Process ◽  
High Doses ◽  
And Control

Progress in recombinant AAV gene therapy product and process development has advanced our understanding of the basic biology of this critical delivery vector. The discovery of rAAV capsid post-translational modifications (PTMs) has spurred interest in the field for detailed rAAV-specific methods for vector lot characterization by mass spectrometry given the unique challenges presented by this viral macromolecular complex. Recent concerns regarding immunogenic responses to systemically administered rAAV at high doses has highlighted the need for investigators to catalog and track potentially immunogenic vector lot components including capsid PTMs and PTMs on host cell protein impurities. Here we present a simple step-by-step guide for academic rAAV laboratories and Chemistry, Manufacturing and Control (CMC) groups in industry to perform an in-house or outsourced bottom-up mass spectrometry workflow to characterize capsid PTMs and process impurities.

Journey to Success for New Analog Technologies for Texas Instruments

2017 ◽  
Vol 2017 (1) ◽  
pp. 000491-000496
Author(s):  
Mario Magaña ◽  
Basab Chatterjee ◽  
Rey Javier
Keyword(s):  
Lower Cost ◽  
Process Development ◽  
Material Selection ◽  
Copper Wire ◽  
Frame Design ◽  
Environmental Controls ◽  
Die Attach ◽  
Higher Power ◽  
Cte Mismatch ◽  
Low K

Abstract TI's commitment to meeting customer requirements has resulted in the development of package technologies and process to improve performance and higher power at lower cost for wire-bonded packages and automotive products are requiring more stringent reliability requirements. Some of the strategies we have adopted include using thinner metal and low-K ILD for lower parasitics and higher performance, thick copper routings for higher power and larger wafer diameters and smaller scribe streets for lower cost and using Copper (Cu) wire. Cu wire is a key enabler due to higher electrical conductivity and lower cost than gold), but also poses integration challenges due to hardness, CTE mismatch and corrosion susceptibility. The hardness of the copper wire imposes significant challenges for wire-bonding on pads w thin metal and low-k ILD. This required co-design of die bond pad structure for enhanced reliability as well as Cu wire process development requires comprehensive approach encompassing multiple areas including ball and stitch parameters, capillary design, bonding processes like segmented bonding and validation of process margins using ‘hammer’ test. Copper wire also requires metrology and test/detection tools like Nomarski, stitch pull test in addition to the traditional wire pull at mid span and neck, rapid-bake test, measuring intermetallics & Al remaining under ball, and Al-splash. The susceptibility of Cu wire to corrosion required us to introduce new materials like PCC and Au-flash PCC, tight environmental controls in the form of forming gas, monitoring of Ph and ion-trappers in BOM, wire oxidation check at outgoing/incoming inspection as SERA (Sequential Electrochemical Reduction Analysis), and paying close attention to handling and non-process gases. More stringent qualification requirements like AEC-006 is driving additional changes to lead frame design and finish, selection of EMC and Die attach, to reduce delamination and epoxy bleed-out. The demands for lower cost is driving us to use larger sized wafers (like 300mm) and narrower scribe width, while packing more functionality into smaller dies thereby driving higher metal densities. Additional requirements for thinner and 3D packages requiring post backgrind thickness as low as 50–75um imposing challenges in terms of warpage and saw. The demand for higher power applications is requiring us to use thick copper routings. We have developed test structures and redesigned layout of the scribe street and scribe seal and pursuing new saw methods. We have also learned many lessons in terms of handling and corrosion risks and implemented safeguards in terms of process and material selection.

Influences of Obstacles Installed in the Container on the Superheated Liquid Boiling

2012 ◽  
Vol 429 ◽  
pp. 62-66 ◽  
Author(s):  
Si Ning Chen
Keyword(s):  
Storage Tank ◽  
High Speed ◽  
Process Development ◽  
Control Measures ◽  
Movement Speed ◽  
Superheated Liquid ◽  
Two Phase ◽  
Microscopic Mechanism ◽  
Boiling Process ◽  
And Control

During the accident mechanism investigation of Boiling Liquid Expanding Vapor Explosion (BLEVE), numerous dada shows that overheated liquid explosive boiling is the main reason and driving force to cause accidents. Research on the micro-process of overheated liquid instant boiling in BLEVE as well as the microscopic mechanism to influence this process development under different device conditions is favorable to seek the preventive and control measures for this accident. In this paper, regarding the mesh obstacle provided inside the storage tank, high-speed camera technology has been utilized to shoot the boiling process during continuous leakage of the storage tank, and the influence of the obstacle on the overheated liquid boiling has been tested and analyzed. It is found out that the boiling process of overheated liquid has been delayed. When the bubbles are rising, the growth process has been suppressed, after passing the obstacle, the movement speed and volume has been decreased, and the upward expansion speed of two-phase flow has also been decreased.

Online/at‐line measurement, analysis and control of product titer and critical product quality attributes (CQAs) during process development

2020 ◽  
Vol 117 (12) ◽  
pp. 3757-3765 ◽  
Author(s):  
Letha Chemmalil ◽  
Tanushree Prabhakar ◽  
June Kuang ◽  
Jay West ◽  
Zhijun Tan ◽  
...  
Keyword(s):  
Product Quality ◽  
Process Development ◽  
Quality Attributes ◽  
Product Titer ◽  
Measurement Analysis ◽  
Line Measurement ◽  
And Control

Wire-bonding process development for low-k materials

2005 ◽  
Vol 81 (1) ◽  
pp. 75-82 ◽  
Author(s):  
Jonathan Tan ◽  
Zhao Wei Zhong ◽  
Hong Meng Ho
Keyword(s):  
Process Development ◽  
Wire Bonding ◽  
Bonding Process ◽  
Low K
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