Impact of Thermal Processing on Silicon Wafer Surface Roughness

2019 ◽  
Vol 16 (8) ◽  
pp. 401-405 ◽  
Author(s):  
Larry W. Shive ◽  
Brian L. Gilmore
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Thermal Processing ◽  
Wafer Surface ◽  
Silicon Wafer Surface

scholarly journals Influence of silicon wafer surface roughness on semiconductor device characteristics

2020 ◽  
Vol 59 (SM) ◽  
pp. SMMB06
Author(s):  
Keiichiro Mori ◽  
Shuichi Samata ◽  
Noritomo Mitsugi ◽  
Akinobu Teramoto ◽  
Rihito Kuroda ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Semiconductor Device ◽  
Wafer Surface ◽  
Silicon Wafer Surface

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

Characterization of Crystal Quality by Crystal Originated Particle Delineation and the Impact on the Silicon Wafer Surface

1998 ◽  
Vol 145 (1) ◽  
pp. 275-284 ◽  
Author(s):  
D. Gräf ◽  
M. Suhren ◽  
U. Lambert ◽  
R. Schmolke ◽  
A. Ehlert ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Crystal Quality ◽  
Wafer Surface ◽  
Silicon Wafer Surface ◽  
The Impact

Clean Silicon Wafer Surface by a Slight Etch Method

1988 ◽  
Author(s):  
Ritsuo Takizawa ◽  
Toshiro Nakanishi ◽  
Kouichirou Honda ◽  
Akira Ohsawa
Keyword(s):  
Silicon Wafer ◽  
Wafer Surface ◽  
Silicon Wafer Surface

Analysis of the Reactant Gas Flow and Heat Transfer on the Silicon Wafer Surface Arranged in a Row in Heating Furnace

2002 ◽  
Vol 2002 (0) ◽  
pp. 275-276
Author(s):  
Naoko SAITO ◽  
Kazushige KIKUTA ◽  
Yukio HISHINUMA ◽  
Takemi CHIKAHISA ◽  
Toshimitsu MIYATA ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Silicon Wafer ◽  
Gas Flow ◽  
Heating Furnace ◽  
Wafer Surface ◽  
Flow And Heat Transfer ◽  
Silicon Wafer Surface
Sign in / Sign up

Export Citation Format

Share Document