Silicon Slice Analyzer Using a He-Ne Laser

1974 ◽  
Vol 121 (5) ◽  
pp. 689 ◽  
Author(s):  
H. J. Ruiz ◽  
C. S. Williams ◽  
F. A. Padovani
Keyword(s):  
Silicon Slice

Influence of Silicon Slice Curvature on Thermally Induced Stresses

1971 ◽  
Vol 118 (1) ◽  
pp. 143 ◽  
Author(s):  
H. R. Huff ◽  
R. C. Bracken ◽  
S. N. Rea
Keyword(s):  
Thermally Induced ◽  
Silicon Slice ◽  
Induced Stresses

Ultra Smooth Polishing Research Based on the Cluster Magnetorheological Effect

2011 ◽  
Vol 487 ◽  
pp. 283-288 ◽  
Author(s):  
Zhan Cheng Wu ◽  
Qiu Sheng Yan ◽  
Zhen Wei Bai ◽  
Ling Ye Kong ◽  
Jing Fu Chai
Keyword(s):  
Surface Roughness ◽  
High Precision ◽  
High Efficiency ◽  
Optical Glass ◽  
Experimental Device ◽  
Silicon Slice ◽  
Order Of Magnitude ◽  
Magnetorheological Effect ◽  
Mr Effect ◽  
K9 Glass

Based on the principle of MR polishing processing, cluster MR-effect polishing method which formed by cluster distributed magnetic body has been put forward in this article. The author analyzed the principle of the cluster MR-effect plane polishing, developed experimental device and conducted processing experiment to K9 optical glass and silicon slice. Results show that the method is feasible and can realize high precision polishing. The surface roughness of K9 glass and silicon slice can achieve respectively Ra0.005µm and Ra0.016µm finally after processed. It has high efficiency at the same time, the surface roughness can decrease 1 order of magnitude after processed 10 minutes, the surface roughness of K9 glass and silicon slice can realize respectively decrease 3 orders of magnitude and 1 order of magnitude after processed 50 minutes.

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