Influence of Silicon Slice Curvature on Thermally Induced Stresses

1971 ◽  
Vol 118 (1) ◽  
pp. 143 ◽  
Author(s):  
H. R. Huff ◽  
R. C. Bracken ◽  
S. N. Rea
Keyword(s):  
Thermally Induced ◽  
Silicon Slice ◽  
Induced Stresses

Morphologies of Nonadherent Al2O3 and Matching Substrate Surfaces

1972 ◽  
Vol 30 ◽  
pp. 524-525
Author(s):  
C. S. Giggins ◽  
J. K. Tien ◽  
B. H. Kear ◽  
F. S. Pettit
Keyword(s):  
Electron Microscopy ◽  
Oxide Scale ◽  
Oxidation Resistance ◽  
Substrate Surface ◽  
Morphological Features ◽  
Thermally Induced ◽  
Oxide Spallation ◽  
Oxidation Resistant ◽  
Induced Stresses ◽  
Substrate Surfaces

The performance of most oxidation resistant alloys and coatings is markedly improved if the oxide scale strongly adheres to the substrate surface. Consequently, in order to develop alloys and coatings with improved oxidation resistance, it has become necessary to determine the conditions that lead to spallation of oxides from the surfaces of alloys. In what follows, the morphological features of nonadherent Al2O3, and the substrate surfaces from which the Al2O3 has spalled, are presented and related to oxide spallation.The Al2O3, scales were developed by oxidizing Fe-25Cr-4Al (w/o) and Ni-rich Ni3 (Al,Ta) alloys in air at 1200°C. These scales spalled from their substrates upon cooling as a result of thermally induced stresses. The scales and the alloy substrate surfaces were then examined by scanning and replication electron microscopy.The Al2O3, scales from the Fe-Cr-Al contained filamentary protrusions at the oxide-gas interface, Fig. 1(a). In addition, nodules of oxide have been developed such that cavities were formed between the oxide and the substrate, Fig. 1(a).

Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

1991 ◽  
Vol 113 (3) ◽  
pp. 258-262 ◽  
Author(s):  
J. G. Stack ◽  
M. S. Acarlar
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Power Dissipation ◽  
Point Of View ◽  
Optical Data ◽  
Data Link ◽  
Element Analysis ◽  
Thermally Induced ◽  
Temperature Changes ◽  
Induced Stresses

The reliability and life of an Optical Data Link transmitter are inversely related to the temperature of the LED. It is therefore critical to have efficient packaging from the point of view of thermal management. For the ODL® 200H devices, it is also necessary to ensure that all package seals remain hermetic throughout the stringent military temperature range requirements of −65 to +150°C. For these devices, finite element analysis was used to study both the thermal paths due to LED power dissipation and the thermally induced stresses in the hermetic joints due to ambient temperature changes

A practical method for calculating thermally-induced stresses in pile foundations used as heat exchangers

2020 ◽  
Vol 126 ◽  
pp. 103743
Author(s):  
Ryan Yin Wai Liu ◽  
Eleonora Sailer ◽  
David M.G. Taborda ◽  
David M. Potts ◽  
Lidija Zdravković
Keyword(s):  
Heat Exchangers ◽  
Practical Method ◽  
Pile Foundations ◽  
Thermally Induced ◽  
Induced Stresses

Thermally induced stresses in end-pumped laser geometries

1987 ◽  
Vol 43 (4) ◽  
pp. 275-292
Author(s):  
J. C. Nieuwoudt ◽  
Scott A. Strobel
Keyword(s):  
Thermally Induced ◽  
Induced Stresses
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