Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process

2019 ◽  
Vol 2 (1) ◽  
pp. 237-241
Author(s):  
Rosa María Luna-Sánchez ◽  
Ignacio González-Martínez
Keyword(s):  
Corrosion Behavior ◽  
Dielectric Barrier ◽  
Copper Diffusion ◽  
Dual Damascene ◽  
Damascene Process

Copper Hillock Induced Copper Diffusion and Corrosion Behavior in a Dual Damascene Process

2007 ◽  
Vol 10 (6) ◽  
pp. H193 ◽  
Author(s):  
Sangchul Kim ◽  
Cheonman Shim ◽  
Jiho Hong ◽  
Hanchoon Lee ◽  
Jaewon Han ◽  
...  
Keyword(s):  
Corrosion Behavior ◽  
Copper Diffusion ◽  
Dual Damascene ◽  
Damascene Process

Dual Damascene Process for FatWires in Copper/FSG Technology

2003 ◽  
Vol 766 ◽  
Author(s):  
J. Gambino ◽  
T. Stamper ◽  
H. Trombley ◽  
S. Luce ◽  
F. Allen ◽  
...  
Keyword(s):  
Line Width ◽  
Lower Cost ◽  
Process Window ◽  
Cmos Process ◽  
Dual Damascene ◽  
Damascene Process ◽  
Interconnect Technology

AbstractA trench-first dual damascene process has been developed for fat wires (1.26 μm pitch, 1.1 μm thickness) in a 0.18 μm CMOS process with copper/fluorosilicate glass (FSG) interconnect technology. The process window for the patterning of vias in such deep trenches depends on the trench depth and on the line width of the trench, with the worse case being an intermediate line width (lines that are 3X the via diameter). Compared to a single damascene process, the dual damascene process has comparable yield and reliability, with lower via resistance and lower cost.

Inorganic Si-O-C Antireflection Coating at 193 nm for Cu Dual Damascene Process

2003 ◽  
Vol 150 (1) ◽  
pp. G58 ◽  
Author(s):  
Sang-Yun Lee ◽  
Yong-Bae Kim ◽  
Jeong Soo Byun
Keyword(s):  
Antireflection Coating ◽  
Dual Damascene ◽  
Damascene Process ◽  
193 Nm

Evaluation of PECVD a-SiC:H as a Cu Diffusion Barrier Layer of Cu Dual Damascene Process

2000 ◽  
Author(s):  
Soo Gun Lee ◽  
Hyeok-Sang Oh ◽  
Hong-Jae Shin ◽  
Jin-Gi Hong ◽  
Hyeon-Deok Lee ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Diffusion Barrier ◽  
Dual Damascene ◽  
Damascene Process ◽  
Diffusion Barrier Layer ◽  
Cu Diffusion Barrier

Advanced CD Control Technology for 65-nm Node Dual Damascene Process

2007 ◽  
Vol 20 (3) ◽  
pp. 245-251 ◽  
Author(s):  
Masatoshi Nagase ◽  
Takuya Maruyama ◽  
Makoto Sekine
Keyword(s):  
Control Technology ◽  
Dual Damascene ◽  
Damascene Process

Effective Defect Control in TiN Metal Hard Mask Cu/Low-k Dual Damascene Process

2013 ◽  
Vol 58 (6) ◽  
pp. 143-150 ◽  
Author(s):  
A. Kabansky ◽  
S. S. H. Tan ◽  
E. A. Hudson ◽  
G. Delgadino ◽  
L. Gancs ◽  
...  
Keyword(s):  
Hard Mask ◽  
Dual Damascene ◽  
Damascene Process ◽  
Defect Control ◽  
Tin Metal ◽  
Low K
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