TEM Observations of Pyramidal Hillocks Formed on (001) Silicon Wafers during Chemical Etching

1980 ◽  
Vol 127 (4) ◽  
pp. 910-913 ◽  
Author(s):  
Fumio Shimura
Keyword(s):  
Chemical Etching ◽  
Silicon Wafers

Fabrication of Microholes in Silicon Wafers by Using Wet-Chemical Etching

2018 ◽  
Vol 68 (8) ◽  
pp. 834-838
Author(s):  
Ha Young LEE ◽  
Ji-Yeon NOH ◽  
Min Sub KWAK ◽  
Kyung-Won LIM ◽  
Hyung Soo AHN ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Silicon Wafers ◽  
Wet Chemical ◽  
Wet Chemical Etching

Ultra-Thin Silicon Wafers Fabrication and Inverted Pyramid Texturing Based on Cu-Catalyzed Chemical Etching

Silicon ◽  
2020 ◽  
Author(s):  
Altyeb Ali Abaker Omer ◽  
Zudong He ◽  
Shihao Hong ◽  
Yuanchih Chang ◽  
Jie Yu ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Silicon Wafers ◽  
Inverted Pyramid ◽  
Thin Silicon

Metal-assisted chemical etching for very high aspect ratio grooves inn-type silicon wafers

2014 ◽  
Vol 24 (12) ◽  
pp. 125026 ◽  
Author(s):  
Katherine Booker ◽  
Maureen Brauers ◽  
Erin Crisp ◽  
Shakir Rahman ◽  
Klaus Weber ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Chemical Etching ◽  
Silicon Wafers ◽  
Type Silicon ◽  
Metal Assisted Chemical Etching ◽  
Very High

Numerical and Experimental Investigation of Wet Chemical Etching of Silicon Wafers

2019 ◽  
Vol 2 (6) ◽  
pp. 295-303 ◽  
Author(s):  
Kimihisa Kaneko ◽  
Akira Tamenori ◽  
Norbert Alleborn ◽  
Franz Durst
Keyword(s):  
Experimental Investigation ◽  
Chemical Etching ◽  
Silicon Wafers ◽  
Wet Chemical ◽  
Wet Chemical Etching

Laser Recovery of Subsurface Damages in Chemomechanically Polished Silicon Wafers

2016 ◽  
Vol 701 ◽  
pp. 97-100
Author(s):  
Keiichiro Niitsu ◽  
Yu Tayama ◽  
Hidenobu Maehara ◽  
Takatoshi Kato ◽  
Ji Wang Yan
Keyword(s):  
Laser Irradiation ◽  
Chemical Etching ◽  
High Performance ◽  
Silicon Wafers ◽  
Laser Raman Spectroscopy ◽  
Laser Raman ◽  
Semiconductor Substrates ◽  
Before And After ◽  
Subsurface Defects

Silicon wafers are the most widely used semiconductor substrates. It has been considered that silicon wafers after chemomechanical polishing (CMP) have no subsurface defects. However, in fact, defects such as dislocation and latent microcracks will remain in the wafers if CMP is performed under unsuitable conditions. In this study, we confirmed the existence of subsurface damages at a depth of submicron level in a silicon wafer after CMP, then used a nanosecond pulsed Nd:YAG laser to repair the subsurface damages. It was found that subsurface defects were recovered to a single crystalline structure by laser irradiation without changing the surface topography. The phase transformation of silicon before and after laser irradiation was confirmed by laser Raman spectroscopy and chemical etching using saturated aqueous solution of Ca(OH)2. The findings from this study contributes to improve the quality of silicon wafers for high-performance semiconductors.

Chemically microsurface-sphericizing on diamond wire-sawn multi-crystalline silicon wafers by metal-assisted chemical etching and rounding etching

Solar Energy ◽  
2021 ◽  
Vol 220 ◽  
pp. 1032-1039
Author(s):  
Jinbing Zhang ◽  
Lang Zhou ◽  
Xiaoying Zhou ◽  
Fayun Zhang ◽  
Yulong Liu ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Crystalline Silicon ◽  
Silicon Wafers ◽  
Diamond Wire ◽  
Metal Assisted Chemical Etching
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