Role of Overpotential on Texture, Morphology and Ductility of Electrodeposited Copper Foils for Printed Circuit Board Applications

1992 ◽  
Vol 139 (6) ◽  
pp. 1592-1600 ◽  
Author(s):  
Xingpu Ye ◽  
M. De Bonte ◽  
J. P. Celis ◽  
J. R. Roos
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Copper Foils

Influence of the area of a thermal pad on optical and thermal parameters of LED modules

Circuit World ◽  
2020 ◽  
Vol 46 (2) ◽  
pp. 65-70 ◽  
Author(s):  
Krzysztof Górecki ◽  
Przemysław Piotr Ptak
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
Printed Circuit Board ◽  
Thermal Parameters ◽  
Circuit Board ◽  
Optical Parameters ◽  
Metal Core ◽  
Content Type ◽  
Printed Circuit

Purpose The purpose of this paper is to present and discuss the results of measurements illustrating influence of the area of a thermal pad and the kind of the used base on thermal and optical parameters of LED modules. Design/methodology/approach LED modules including six power LEDs are designed. In the layout of these modules, different areas of a thermal pad of each LED are used. These modules are made using the classical FR-4 base and metal core printed circuit board (MCPCB). Thermal and optical parameters of all the tested modules are measured using the method elaborated by the authors. Findings The obtained results of measurements prove that increasing the area of a thermal pad causes a decrease in thermal resistance of the tested LED modules and an increase in power density of the emitted light. The role of the area of a thermal pad is more important for the classical FR-4 base than for MCPCB. Research limitations/implications Investigations were performed for only two values of the area of thermal pads and selected values of LEDs forward current. Originality/value The presented results of investigations show how the used layout and type of the used base of these modules influence optical and thermal parameters of LED modules. Changing the base of a module can cause even a double decrease in thermal resistance and a double increase in power density of the emitted light.

An Overview of Materials Science in Printed Circuit Packaging

1984 ◽  
Vol 40 ◽  
Author(s):  
D. P. Seraphim ◽  
L. C. Lee ◽  
B. K. Appelt ◽  
L. L. Marsh
Keyword(s):  
Printed Circuit Board ◽  
Materials Science ◽  
Scientific Data ◽  
Circuit Board ◽  
Mechanical State ◽  
Printed Circuit ◽  
Control Techniques ◽  
And Diffusion ◽  
Scientific Base

AbstractA brief description of a set of processes and materials to make printed circuit panels will be given. Then we will discuss the multi-disciplines required for forming a scientific base and provide examples where the fundamentalist and often times specialist is providing the scientific data needed by the packaging engineer. Control techniques, characterization or otherwise basic information helpful in decision making is provided to the development and production groups. Specifically, the state of resin cure at critical steps in the process is used to demonstrate the inter-relation between cure, flow, and mechanical properties in affecting printed circuit board integrity. Finally, the complex role of moisture solubility and diffusion from the process environment in perturbing the chemical and mechanical state is discussed.

Role of a Printed Circuit Board Copper Clad Current Collector in Supercapacitor Application

2019 ◽  
Vol 48 (9) ◽  
pp. 5835-5842 ◽  
Author(s):  
Shabeeba Pilathottathil ◽  
Mohamed Shahin Thayyil ◽  
M. P. Pillai ◽  
A. P. Jemshihas
Keyword(s):  
Printed Circuit Board ◽  
Current Collector ◽  
Circuit Board ◽  
Supercapacitor Application ◽  
Printed Circuit

CO2 Laser Induced Blind-Via for Direct Electroplating

2014 ◽  
Vol 875-877 ◽  
pp. 1352-1356 ◽  
Author(s):  
Yu Xin Huang ◽  
Wei He ◽  
Zhi Hua Tao ◽  
Huan Xv ◽  
Xv Luo
Keyword(s):  
Laser Beam ◽  
Beam Energy ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Copper Particles ◽  
Conductive Film ◽  
Film Layer ◽  
Electroplating Process

Blind-via plays a crucial role in interlayer interconnection of printed circuit board. To get the blind via metallized a direct electroplating process has been put forward by the way of a inducing CO2 laser beam irradiating the copper in the bottom of blind via. The method for direct electroplating of copper onto a non-copper platable layer has been investigated in blind via metalization. The regression analysis was used to discuss the laser beam energy in different parameters. The results of electroplated blind via showed that the copper in the bottom of blind via can be induced by CO2 laser, and the induced copper particles ejected to the hole wall plays a role of the conductive film layer that mainly composed of copper by electroless plating or carbon black conductive film during electroplating, plasma used in cleaning blind via can promote the sorption of induced copper particles onto the via wall.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission
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