Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board

In contrast to the existing electromechanical systems, the noncontact-type capacitive measurement allows for a chemically and mechanically isolated, continuous, and inherently wear-free measurement. Integration of the sensor directly into the container’s wall offers considerable savings potential because of miniaturization and installation efforts. This paper presents the implementation of noncontact (NC)-type level sensing techniques utilizing the Programmable System on Chip (PSoC). The hardware system developed based on the PSoC microcontroller is interfaced with capacitive-based printed circuit board (PCB) strip. The designer has the choice of placing the sensors directly on the container or close to it. This sensor technology can measure both the conductive and nonconductive liquids with equal accuracy.

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Evaluation of the Radiated Emission of a Printed Circuit Board Attached with Cables

Proceedings of the 3rd International Conference on Electric and Electronics ◽

10.2991/eeic-13.2013.45 ◽

2013 ◽

Cited By ~ 1

Author(s):

Ahmed Sayegh ◽

Mohd Zarar Mohd Jenu

Keyword(s):

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit ◽

Radiated Emission

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Influence of the area of a thermal pad on optical and thermal parameters of LED modules

Circuit World ◽

10.1108/cw-11-2019-0174 ◽

2020 ◽

Vol 46 (2) ◽

pp. 65-70 ◽

Cited By ~ 2

Author(s):

Krzysztof Górecki ◽

Przemysław Piotr Ptak

Keyword(s):

Thermal Resistance ◽

Power Density ◽

Printed Circuit Board ◽

Thermal Parameters ◽

Circuit Board ◽

Optical Parameters ◽

Metal Core ◽

Content Type ◽

Printed Circuit

Purpose The purpose of this paper is to present and discuss the results of measurements illustrating influence of the area of a thermal pad and the kind of the used base on thermal and optical parameters of LED modules. Design/methodology/approach LED modules including six power LEDs are designed. In the layout of these modules, different areas of a thermal pad of each LED are used. These modules are made using the classical FR-4 base and metal core printed circuit board (MCPCB). Thermal and optical parameters of all the tested modules are measured using the method elaborated by the authors. Findings The obtained results of measurements prove that increasing the area of a thermal pad causes a decrease in thermal resistance of the tested LED modules and an increase in power density of the emitted light. The role of the area of a thermal pad is more important for the classical FR-4 base than for MCPCB. Research limitations/implications Investigations were performed for only two values of the area of thermal pads and selected values of LEDs forward current. Originality/value The presented results of investigations show how the used layout and type of the used base of these modules influence optical and thermal parameters of LED modules. Changing the base of a module can cause even a double decrease in thermal resistance and a double increase in power density of the emitted light.

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An Overview of Materials Science in Printed Circuit Packaging

MRS Proceedings ◽

10.1557/proc-40-21 ◽

1984 ◽

Vol 40 ◽

Cited By ~ 2

Author(s):

D. P. Seraphim ◽

L. C. Lee ◽

B. K. Appelt ◽

L. L. Marsh

Keyword(s):

Printed Circuit Board ◽

Materials Science ◽

Scientific Data ◽

Circuit Board ◽

Mechanical State ◽

Printed Circuit ◽

Control Techniques ◽

And Diffusion ◽

Scientific Base

AbstractA brief description of a set of processes and materials to make printed circuit panels will be given. Then we will discuss the multi-disciplines required for forming a scientific base and provide examples where the fundamentalist and often times specialist is providing the scientific data needed by the packaging engineer. Control techniques, characterization or otherwise basic information helpful in decision making is provided to the development and production groups. Specifically, the state of resin cure at critical steps in the process is used to demonstrate the inter-relation between cure, flow, and mechanical properties in affecting printed circuit board integrity. Finally, the complex role of moisture solubility and diffusion from the process environment in perturbing the chemical and mechanical state is discussed.

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An Optimized On-Chip Boost-Type DC-DC Converter With an On-Board Inductance

2014 Conference on Information Storage and Processing Systems ◽

10.1115/isps2014-6967 ◽

2014 ◽

Author(s):

Paul C.-P. Chao ◽

Ching-Hua Kuan ◽

Jia-Wei Su

Keyword(s):

Printed Circuit Board ◽

High Efficiency ◽

Rapid Development ◽

Current Drive ◽

Circuit Board ◽

Electronic Products ◽

Fully Integrated ◽

Printed Circuit ◽

Limited Output ◽

On Chip

The rapid development of portable electronic products in recent years increases demands of varied displays. With resolutions of panel sizes and pixels under current drive capability improved, this study is intended for designing an inductive DC boost converter circuit for displays, which is fully integrated with IC fabrication technology [1][2]. Most of current displays employ capacitances for voltage-boosting to supply relative high-voltage biases to displays. These booster circuits are in small sizes and with high efficiency, but limited output currents, which are inadequate for some of large-sized displays. To remedy the problem, an on-board, small-sized inductor in the forms of coils in a printed circuit board (PCB) is proposed for a superior solution. This PCB-type inductor can be incorporated into the same board with other drive chips for the displays, while offering large, adequate current, as an incapable task via an on-chip coil.

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