Selective Epitaxial Growth of Silicon by the A.C. Technique: II . Ion‐Implanted Substrate/Oxide Surfaces

1995 ◽  
Vol 142 (7) ◽  
pp. 2450-2455
Author(s):  
Q. S. Wang ◽  
A. Reisman ◽  
D. Temple ◽  
R. Alberti
2004 ◽  
Vol 810 ◽  
Author(s):  
Christian Isheden ◽  
Per-Erik Hellström ◽  
Henry H. Radamson ◽  
Mikael Östling

ABSTRACTIntegration issues concerning recessed epitaxial SiGe(B) source/drain junctions formed by selective Si etching followed by selective epitaxial growth of in situ heavily B-doped Si1−xGex are presented. The concept is beneficial compared to conventional ion implanted junctions, since dopant activation above the solid solubility in Si can be obtained. When integrated in the PMOS process flow, the resulting Si1−xGex layer is very rough. Several possible causes for low quality epitaxy are discussed and improvements are proposed. It is suggested that the dopant type and/or concentration in the silicon substrate can have an effect on the process.


1995 ◽  
Vol 142 (7) ◽  
pp. 2438-2449 ◽  
Author(s):  
Q. S. Wang ◽  
A. Reisman ◽  
D. Temple ◽  
R. Alberti

1992 ◽  
Vol 18 (3) ◽  
pp. 237-246 ◽  
Author(s):  
N. Afshar-Hanaii ◽  
J.M. Bonar ◽  
A.G.R. Evans ◽  
G.J. Parker ◽  
C.M.K. Starbuck ◽  
...  

2017 ◽  
Vol 56 (10) ◽  
pp. 105503
Author(s):  
Kiichi Furukawa ◽  
Akinobu Teramoto ◽  
Rihito Kuroda ◽  
Tomoyuki Suwa ◽  
Keiichi Hashimoto ◽  
...  

1988 ◽  
Vol 43 (8) ◽  
pp. 2031-2036 ◽  
Author(s):  
M. Kastelic ◽  
I. Oh ◽  
C.G. Takoudis ◽  
J.A. Friedrich ◽  
G.W. Neudeck

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