One-Mask CMOS Compatible Process for the Fabrication of Three-Dimensional Self-Assembled Thin-Film SOI Microelectromechanical Systems

2005 ◽  
Vol 8 (10) ◽  
pp. H87 ◽  
Author(s):  
F. Iker ◽  
N. André ◽  
T. Pardoen ◽  
J.-P. Raskin
Keyword(s):  
Thin Film ◽  
Microelectromechanical Systems ◽  
Three Dimensional ◽  
Cmos Compatible ◽  
Self Assembled

scholarly journals Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems

Sensors ◽  
2020 ◽  
Vol 20 (7) ◽  
pp. 2133 ◽  
Author(s):  
Anna Persano ◽  
Fabio Quaranta ◽  
Antonietta Taurino ◽  
Pietro Aleardo Siciliano ◽  
Jacopo Iannacci
Keyword(s):  
Thin Film ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Sacrificial Layer ◽  
Three Dimensional ◽  
Telecommunication Systems ◽  
Rf Performance ◽  
Three Dimensional Finite Element ◽  
The Impact ◽  
Thin Film Encapsulation

In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and modern telecommunication systems. Simplification and cost reduction of the fabrication process were obtained, using two etching processes in the same barrel chamber to create a matrix of holes through the capping layer and to remove the sacrificial layer under the cap. Encapsulating layers with etch holes of different size and density were fabricated to evaluate the removal of the sacrificial layer as a function of the percentage of the cap perforated area. Barrel etching process parameters also varied. Finally, a full three-dimensional finite element method-based simulation model was developed to predict the impact of fabricated thin film encapsulating caps on RF performance of CPWs.

Characteristics of Ti-Ni-Zr Thin Film Metallic Glasses / Thin Film Shape Memory Alloys for Micro Actuators with Three-Dimensional Structures

2015 ◽  
Vol 9 (6) ◽  
pp. 662-667 ◽  
Author(s):  
Junpei Sakurai ◽  
◽  
Seiichi Hata
Keyword(s):  
Thin Film ◽  
Shape Memory Alloys ◽  
Shape Memory ◽  
Metallic Glasses ◽  
Microelectromechanical Systems ◽  
Three Dimensional ◽  
Eutectic Point ◽  
Supercooled Liquid ◽  
Supercooled Liquid Region ◽  
Liquid Region

In this paper, we investigate the characteristics of Ti-Ni-Zr thin film metallic glasses (TFMGs)/ shape memory alloys (SMAs) for microelectromechanical systems (MEMS) applications with three-dimensional structures. The amorphous Ti-Ni-Zr thin films having a Ni content of more than 50 at.% and Zr content of more than 11 at.% undergo glass transitions and are TFMGs. The Ti39Ni50Zr11TFMG has the lowest glass transition temperatureTgof 703 K and a wide supercooled liquid region ΔTof 57 K. Moreover, it has high thermal stability atTg. However, the apparent viscosity of the Ti39Ni50Zr11is higher than those of other Ti-Ni-Zr TFMGs. Moreover, the Ti-Ni-Zr TFMG exhibits higher viscosity than conventional TFMGs because the alloy composition of Ti-Ni-Zr TFMGs/SMAs is far from the eutectic point.

scholarly journals Self-assembled three-dimensional and compressible interdigitated thin-film supercapacitors and batteries

2015 ◽  
Vol 6 (1) ◽  
Author(s):  
Gustav Nyström ◽  
Andrew Marais ◽  
Erdem Karabulut ◽  
Lars Wågberg ◽  
Yi Cui ◽  
...  
Keyword(s):  
Thin Film ◽  
Three Dimensional ◽  
Self Assembled

Three-Dimensional Self-Assembled Sensors in Thin-Film SOI Technology

2006 ◽  
Vol 15 (6) ◽  
pp. 1687-1697 ◽  
Author(s):  
Franois Iker ◽  
Nicolas Andre ◽  
Thomas Pardoen ◽  
Jean-Pierre Raskin
Keyword(s):  
Thin Film ◽  
Three Dimensional ◽  
Self Assembled ◽  
Soi Technology

Imaging of platinum-shadowed macromolecular complexes in dark field

1984 ◽  
Vol 42 ◽  
pp. 146-147
Author(s):  
D.W. Andrews ◽  
F.P. Ottensmeyer
Keyword(s):  
Thin Film ◽  
Three Dimensional ◽  
Average Diameter ◽  
Dark Field ◽  
Bright Field ◽  
Field Mode ◽  
Macromolecular Complexes ◽  
Average Mass ◽  
Topological Features ◽  
Projection Images

Shadowing with heavy metals has been used for many years to enhance the topological features of biological macromolecular complexes. The three dimensional features present in directionaly shadowed specimens often simplifies interpretation of projection images provided by other techniques. One difficulty with the method is the relatively large amount of metal used to achieve sufficient contrast in bright field images. Thick shadow films are undesirable because they decrease resolution due to an increased tendency for microcrystalline aggregates to form, because decoration artefacts become more severe and increased cap thickness makes estimation of dimensions more uncertain.The large increase in contrast provided by the dark field mode of imaging allows the use of shadow replicas with a much lower average mass thickness. To form the images in Fig. 1, latex spheres of 0.087 μ average diameter were unidirectionally shadowed with platinum carbon (Pt-C) and a thin film of carbon was indirectly evaporated on the specimen as a support.

Nanoscale Self-Assembly Using Ion and Electron Beam Techniques: A Rapid Review

MRS Advances ◽  
2020 ◽  
Vol 5 (64) ◽  
pp. 3507-3520
Author(s):  
Chunhui Dai ◽  
Kriti Agarwal ◽  
Jeong-Hyun Cho
Keyword(s):  
Electron Beam ◽  
Self Assembly ◽  
Ion Beam ◽  
Three Dimensional ◽  
The Self ◽  
Stress Generation ◽  
Rapid Review ◽  
High Yield ◽  
3D Nanostructures ◽  
Self Assembled

AbstractNanoscale self-assembly, as a technique to transform two-dimensional (2D) planar patterns into three-dimensional (3D) nanoscale architectures, has achieved tremendous success in the past decade. However, an assembly process at nanoscale is easily affected by small unavoidable variations in sample conditions and reaction environment, resulting in a low yield. Recently, in-situ monitored self-assembly based on ion and electron irradiation has stood out as a promising candidate to overcome this limitation. The usage of ion and electron beam allows stress generation and real-time observation simultaneously, which significantly enhances the controllability of self-assembly. This enables the realization of various complex 3D nanostructures with a high yield. The additional dimension of the self-assembled 3D nanostructures opens the possibility to explore novel properties that cannot be demonstrated in 2D planar patterns. Here, we present a rapid review on the recent achievements and challenges in nanoscale self-assembly using electron and ion beam techniques, followed by a discussion of the novel optical properties achieved in the self-assembled 3D nanostructures.

Electrolysis on a Chip with Tunable Thin Film Nanostructured PGM Electrocatalysts Generated from Self‐Assembled Block Copolymer Templates

Small ◽  
2021 ◽  
pp. 2100437
Author(s):  
Deepra Bhattacharya ◽  
Subarna Kole ◽  
Orhan Kizilkaya ◽  
Joseph Strzalka ◽  
Polyxeni P. Angelopoulou ◽  
...  
Keyword(s):  
Thin Film ◽  
Block Copolymer ◽  
Self Assembled
Sign in / Sign up

Export Citation Format

Share Document