Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

C. Gui; M. Elwenspoek; J. G. E. Gardeniers; P. V. Lambeck

doi:10.1149/1.1838616

Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

Journal of The Electrochemical Society ◽

10.1149/1.1838616 ◽

1998 ◽

Vol 145 (6) ◽

pp. 2198-2204 ◽

Cited By ~ 17

Author(s):

C. Gui ◽

M. Elwenspoek ◽

J. G. E. Gardeniers ◽

P. V. Lambeck

Keyword(s):

Wafer Bonding ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Future Role

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ChemInform Abstract: Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

ChemInform ◽

10.1002/chin.199831325 ◽

2010 ◽

Vol 29 (31) ◽

pp. no-no

Author(s):

C. GUI ◽

M. ELWENSPOEK ◽

J. G. E. GARDENIERS ◽

P. V. LAMBECK

Keyword(s):

Wafer Bonding ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Future Role

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Role of Amine and Carboxyl Functional Groups of Complexing Agents in Slurries for Chemical Mechanical Polishing of Copper

Journal of The Electrochemical Society ◽

10.1149/1.2083287 ◽

2005 ◽

Vol 152 (12) ◽

pp. G912 ◽

Cited By ~ 37

Author(s):

Venkata R. K. Gorantla ◽

Dan Goia ◽

Egon Matijević ◽

S. V. Babu

Keyword(s):

Functional Groups ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Complexing Agents

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Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing

Colloids and Surfaces A Physicochemical and Engineering Aspects ◽

10.1016/j.colsurfa.2010.05.026 ◽

2010 ◽

Vol 366 (1-3) ◽

pp. 68-73 ◽

Cited By ~ 7

Author(s):

P.R. Veera Dandu ◽

B.C. Peethala ◽

Naresh K. Penta ◽

S.V. Babu

Keyword(s):

Amino Acids ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Removal Rates ◽

Polysilicon Films

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The Role of Ferric Oxide Nanoparticles in Improving Lubricity and Tribo-Electrochemical Performance During Chemical–Mechanical Polishing

Tribology Letters ◽

10.1007/s11249-016-0806-4 ◽

2016 ◽

Vol 65 (1) ◽

Cited By ~ 1

Author(s):

Vladimir Totolin ◽

Hakan Göcerler ◽

Manel Rodríguez Ripoll ◽

Martin Jech

Keyword(s):

Electrochemical Performance ◽

Ferric Oxide ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Oxide Nanoparticles

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Role of ionic strength in chemical mechanical polishing of silicon carbide using silica slurries

Colloids and Surfaces A Physicochemical and Engineering Aspects ◽

10.1016/j.colsurfa.2014.01.038 ◽

2014 ◽

Vol 445 ◽

pp. 119-127 ◽

Cited By ~ 29

Author(s):

Uma Rames Krishna Lagudu ◽

Shintaro Isono ◽

Sitaraman Krishnan ◽

S.V. Babu

Keyword(s):

Silicon Carbide ◽

Ionic Strength ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing

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Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters

10.1016/b978-0-12-821791-7.00015-0 ◽

2022 ◽

pp. 451-467

Author(s):

M. Tsujimura

Keyword(s):

Chemical Mechanical Polishing ◽

Removal Rate ◽

Mechanical Polishing

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Role of Guanidine Carbonate and Crystal Orientation on Chemical Mechanical Polishing of Ruthenium Films

ECS Journal of Solid State Science and Technology ◽

10.1149/2.018311jss ◽

2013 ◽

Vol 2 (11) ◽

pp. P445-P451 ◽

Cited By ~ 31

Author(s):

H. P. Amanapu ◽

K. V. Sagi ◽

L. G. Teugels ◽

S. V. Babu

Keyword(s):

Chemical Mechanical Polishing ◽

Crystal Orientation ◽

Mechanical Polishing ◽

Guanidine Carbonate

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Chemical Mechanical Polishing of Al and SiO2 Thin Films: The Role of Consumables

Journal of The Electrochemical Society ◽

10.1149/1.1392688 ◽

1999 ◽

Vol 146 (12) ◽

pp. 4647-4653 ◽

Cited By ~ 23

Author(s):

J. Hernandez ◽

P. Wrschka ◽

Y. Hsu ◽

T. ‐S. Kuan ◽

G. S. Oehrlein ◽

...

Keyword(s):

Thin Films ◽

Chemical Mechanical Polishing ◽

Mechanical Polishing

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Role of crystal orientation on chemical mechanical polishing of single crystal copper

Applied Surface Science ◽

10.1016/j.apsusc.2016.06.030 ◽

2016 ◽

Vol 386 ◽

pp. 262-268 ◽

Cited By ~ 5

Author(s):

Aibin Zhu ◽

Dayong He ◽

Wencheng Luo ◽

Yangyang Liu

Keyword(s):

Single Crystal ◽

Chemical Mechanical Polishing ◽

Crystal Orientation ◽

Mechanical Polishing ◽

Single Crystal Copper

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Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters

Advances in Chemical Mechanical Planarization (CMP) ◽

10.1016/b978-0-08-100165-3.00016-4 ◽

2016 ◽

pp. 417-432

Author(s):

M. Tsujimura

Keyword(s):

Chemical Mechanical Polishing ◽

Removal Rate ◽

Mechanical Polishing

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