Electromigration Drift Velocity in Al‐Alloy and Cu‐Alloy Lines

1996 ◽  
Vol 143 (3) ◽  
pp. 1001-1006 ◽  
Author(s):  
C.‐K. Hu ◽  
K. Y. Lee ◽  
K. L. Lee ◽  
C. Cabral ◽  
E. G. Colgan ◽  
...  
Keyword(s):  
Drift Velocity ◽  
Al Alloy ◽  
Cu Alloy

Microstructure, Texture and Mechanical Properties of Al Alloy A380 Prepared by Directional Solidification Method

2019 ◽  
Vol 287 ◽  
pp. 18-23
Author(s):  
Hemant Borkar ◽  
Salem Seifeddine ◽  
Anders E.W. Jarfors
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Directional Solidification ◽  
Solidification Rate ◽  
Al Alloy ◽  
Secondary Dendrite Arm Spacing ◽  
Β Phase ◽  
Cu Alloy ◽  
Eutectic Si ◽  
The One

The mechanical properties of Al-Si alloys are affected by several microstructural features such as secondary dendrite arm spacing (SDAS), size and shape of eutectic Si-particles, presence of intermetallics as well as by porosity. In the current study, Al-Si-Cu alloy A380 was prepared by a unique directional solidification method to produce samples with two different SDAS of 9 μm and 27 μm. The lower solidification rate resulted in larger SDAS, larger grain size, larger eutectic Si and larger intermetallics including Fe-rich β phase. The microstructure with higher solidification rate was found to be finer and more homogeneous with smaller eutectic Si and intermetallics. The specimen with larger SDAS exhibited stronger texture than the one with smaller SDAS. The specimen with smaller SDAS showed improved mechanical properties including YS, UTS and ductility.

Residual Gas Phase Contamination of Al-Cu Alloy Films and its Effect on Electromigration Behavior

1996 ◽  
Vol 428 ◽  
Author(s):  
Imran Hashim ◽  
Ivo J. Raaijmakers ◽  
Glen Adler ◽  
Ardy Sidhwa ◽  
Sudhir Chopra
Keyword(s):  
Gas Phase ◽  
Physical Vapor Deposition ◽  
Target Material ◽  
Vacuum System ◽  
Al Alloy ◽  
Alloy Films ◽  
Cu Alloy ◽  
Effect Of Impurities ◽  
Residual Gas ◽  
Vacuum Systems

AbstractThe major sources of impurities in sputtered Al alloy films for interconnects, prepared by physical vapor deposition include those originating from the target material, residual gases present in the vacuum system, and those introduced through the gas delivery system. In this study, we report the effect of impurities incorporated from residual gases present in vacuum systems on the electromigration performance of 0.6 μm wide Al-l%Cu lines. Controlled leaks of isotope gases H2O18, N215, O218, and C13H4, in 10−6 10−9 Torr range, were introduced into a PVD tool during the sputtering process. Using these isotope gases, the impurities originating from residual gases were distinguished from those originating from other sources of impurities. The sputtering target was found to be the major source of H and O impurities in the film, whereas N atoms are introduced in the film mainly through the gas phase. Furthermore, N atoms in the film were found to affect its electromigration behaviour to a larger extent than O and H.

A Novel Process for Fabricating Aluminium Alloy Porous Structure for Possible Application in Antimicrobial Filtration

2015 ◽  
Vol 828-829 ◽  
pp. 359-365 ◽  
Author(s):  
Agripa Hamweendo ◽  
Ionel Botef
Keyword(s):  
Drinking Water ◽  
Porous Structure ◽  
Aluminium Alloy ◽  
Metal Foam ◽  
Al Alloy ◽  
Cu Alloy ◽  
Contaminated Drinking Water ◽  
Micro Organisms ◽  
Water Borne ◽  
Alloy Metal

This paper presents a novel process for fabricating micro-porous Aluminium (Al) alloy structures with possible application in antimicrobial filtration of drinking water which is contaminated with pathogenic micro-organisms responsible for water-borne diseases. This process is an integration of cold spray (CS) with the alloy-de-alloy phenomenon. In this process, the Al, Aluminium oxide () and Copper (Cu) powders with antimicrobial capabilities were mixed and deposited directly onto to a substrate using CS. To create porosity in the Al-Alumina-Cu coating, pores were innovatively engineered by alloying the Al--Cu with pore forming agents followed by preferential de-alloyed of these agents. The resulting structures have promising microstructural composition and porosity which make them favourable for antimicrobial filtration of contaminated drinking water. Consequently, this research demonstrates that via CS, a novel process was developed for fabricating porous Al-Alumina-Cu alloy metal foam for application in decontamination of drinking water.

Microstructures of thermomechanically treated eutectoid Zn–Al alloy (II)

1995 ◽  
Vol 10 (8) ◽  
pp. 1927-1932 ◽  
Author(s):  
Yao Hua Zhu ◽  
Frank E. Goodwin
Keyword(s):  
Prior Treatment ◽  
Extrusion Temperature ◽  
Al Alloy ◽  
X Ray Diffraction ◽  
Cast State ◽  
X Ray ◽  
Cu Alloy ◽  
Α Phase ◽  
Evolution Of Microstructure ◽  
Three Phases

The evolution of microstructure in a cast, extruded, and aged eutectoid Zn-Al-Cu alloy is described based on x-ray diffraction an micrographic observations. Whereas the three phases α′, β′, and η′ were found in the as-cast state, the three phases α, T′, and η′E were observed in this alloy after extrusion at 250 °C. The Al-rich fcc α phase appeared as isolated particles with clear boundaries. The Zn-rich η′E phase decomposed upon aging into α, T′, and η phases. It was found possible to control the phase makeup of the alloy by controlling extrusion temperature. At extrusion temperatures greater than 268 °C, α, E, and η′E were detected, whereas temperatures below this, the phases α, T′, and η′E were found. After prolonged aging, the phase makeup of the alloy was found to be the same regardless of prior treatment routes. Early shrinkage of the extruded alloy occurred after aging at 91 and 150 °C and was related to precipitation of aluminum from the η′E phase during its decomposition to α, T′, and η products.

scholarly journals Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil

2010 ◽  
Vol 51 (10) ◽  
pp. 1753-1758 ◽  
Author(s):  
Ikuo Shohji ◽  
Shinji Koyama ◽  
Itaru Oshiro ◽  
Hideaki Nara ◽  
Yoshiharu Iwata
Keyword(s):  
Lead Free ◽  
Al Alloy ◽  
Fluxless Bonding ◽  
Cu Alloy ◽  
Cu Foil

Microstructural Evolution and Crystal Orientation of Electromagnetically Stirred Al Alloy in the Semi-Solid State

2007 ◽  
Vol 544-545 ◽  
pp. 399-402 ◽  
Author(s):  
Dock Young Lee ◽  
Suk Won Kang ◽  
Ha Young Kim ◽  
Ki Bae Kim
Keyword(s):  
Magnetic Flux ◽  
Flux Density ◽  
Solid Phase ◽  
Dendritic Structure ◽  
Solid Metal ◽  
Magnetic Flux Density ◽  
Al Alloy ◽  
Cu Alloy ◽  
Α Phase ◽  
Semi Solid

Through more than three decades of development, a semi-solid metal processing has been successfully established as a unique casting technique to produce a structural component for an automobile industry with high integrity and improved mechanical properties. A slurry-on-demand process to make the semi-solid slurry having a fine and globular microstructure has been very important in the semi-solid metal process. In the present study, the orientation distribution functions (ODFs) calculated from the pole figure data were examined and tried to characterize the bulky morphology of primary solid phase of the semi-solid slurry of Al-Cu alloy produced with various magnetic flux density of 100 to 300Gauss in the specially designed electromagnetic (EM) stirrer. Columnar dendritic structure of primary α phase was turned into a rosette and globular structure by EM stirring during solidification. The primary α phase was refined and globularized with increasing a magnetic flux density of EM stirring. Also, due to the EM stirring the tendency to random orientation was appeared. In the case of unstirred Al-Cu alloy the <110>//ND texture was developed strongly and <100>//ND and <111>//ND texture was weakly developed. But with the increase of the EM stirring strength, <100>//ND and <111>//ND texture were more strongly advanced. Due to EM stirring the texture was almost completely randomized.

Temperature Dependence of Internal Stress and Crystal Growth of Dilute Cu Alloy Films

2007 ◽  
Vol 127 ◽  
pp. 147-152 ◽  
Author(s):  
Yousuke Koike ◽  
Toshio Inase ◽  
Shinji Takayama
Keyword(s):  
Internal Stress ◽  
Grain Growth ◽  
Internal Stresses ◽  
Al Alloy ◽  
Alloy Films ◽  
Dilute Alloys ◽  
Cu Alloy ◽  
Hillock Formation ◽  
Pure Cu ◽  
Deposited Films

Annealing behavior of dilute Cu-X alloys (adding element X = transition metal and rare-earth metal with less than 3 at %) was investigated in terms of resistivity, internal stress, grain growth and hillock formation. The resistivity increases with addition of impurities regardless of kinds of adding elements. Generally, resistivity starts to decrease on annealing above 200 °C. Among present Cu dilute alloys, Sn addition shows the lowest resistivity 2.5 μΩcm on annealing at 400 °C. However, compared with a pure Cu film, salient grain growth of present dilute alloys does not takes place even at temperatures above 300 °C , where the grain size is nearly the same as that of as-deposited films. In-situ surface observation using an atomic force microscope (AFM ) revealed that hillocks did not grow on cooling stage (under tension), but started to form on heating stage (under compression). The scanning electron microscopy (SEM) observation of hillocks thus formed in present dilute alloy films shows that the external appearance of these defects was quite different from those observed in Al and Al alloy films. They most likely grow with a preferential crystal plane, not irregular growth like Al and Al alloy films. The internal stresses in most of the present as-deposited dilute Cu alloy films were nearly zero or compression of –25 to –100MPa, and upon annealing, they started to increase in tensile manner due to thermal stresses induced by the mismatch of the thermal expansion between substrates and deposited films. A large stress relaxation started to occur above 250°C, associating with a large number of hillock formation.

scholarly journals Influence of Sealing Treatment on the Corrosion Resistance of PEO Coated Al-Zn-Mg-Cu Alloy in Various Environments

Coatings ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 867 ◽  
Author(s):  
Diping Zeng ◽  
Zhiyi Liu ◽  
Song Bai ◽  
Jian Wang
Keyword(s):  
Corrosion Resistance ◽  
Electrochemical Impedance ◽  
Sol Gel ◽  
Al Alloy ◽  
Cu Alloy ◽  
Electrolytic Oxidation ◽  
Alkaline Environments ◽  
Tetraethoxy Silane ◽  
Plasma Electrolytic ◽  
Sealing Treatment

In the present work, a coating was prepared on an Al alloy substrate by plasma electrolytic oxidation (PEO). To seal the micro defects in the oxide scale, a siloxane layer was prepared on the PEO coating by sol gel method. The polymer sealant was synthesized from Tetraethoxy silane (TEOS) and methacryloxy propyl trimethoxyl silane (MPTES). The chemical structure of the polymer was studied by Fourier transform infrared spectroscopy (FTIR). The morphologies and microstructure of the PEO coating and siloxane coating were investigated by scanning electron microscopy (SEM). The results showed that siloxane formed a continuous layer on the surface and effectively sealed the micro defects. The corrosion behavior of the coatings in three different corrosion solutions (NaCl, HCl, and NaOH) was examined by electrochemical impedance spectroscopy and potentiodynamic polarization. The corrosion resistance of the sealed coatings was superior to that of the PEO coating because it prevented the penetration of corrosive solutions. The corrosion resistance of the sealed coatings was found to decrease with increasing electrolyte concentration. The work demonstrated that siloxane sealing may greatly enhance the corrosion resistance of Al-based PEO coating in acidic, neutral, and alkaline environments.

An Investigation on the Sintering Behavior of High Strength Al-Zn-Mg-Cu Alloy Prepared from Elemental Powders

2007 ◽  
Vol 534-536 ◽  
pp. 489-492 ◽  
Author(s):  
Maziar Shahmohammadi ◽  
Abdolreza Simchi ◽  
Herbert Danninger ◽  
A. Arvand
Keyword(s):  
High Strength ◽  
Dimensional Change ◽  
Sintering Behavior ◽  
Al Alloy ◽  
Cu Alloy ◽  
Liquid Phases ◽  
Microstructural Evaluation ◽  
Different Temperatures ◽  
Melt Penetration ◽  
Transient Liquid Phases

In the present work, the sintering behavior of high strength Al-5.6Zn-2.5Mg-1.6Cu (in wt.%) alloy compacts was investigated. Green parts made by pressing of mixed elemental powders were sintered at different temperatures between 400 and 600 °C. The effect of the sintering temperature on density, dimensional change and microstructure of the Al alloy was studied. Microstructural evaluation was accompanied by XRD and DSC methods in order to determine the temperature and chemical composition of the liquid phases formed during sintering. It was found that three transient liquid phases are formed at 420, 439 and 450 °C. Microstructural study revealed the progressive formation of sintered contacts due to the presence of the liquid phases, although the green compact expands as a result of the melt penetration along the grain boundaries. While Zn melts at ~420 °C, the intermetallic phases between Al and Mg were found to be responsible for the formation of liquid phase and the dimensional change at higher temperatures.

The Role of Processing Routes on the Evolution of Microstructure and Texture Heterogeneity during ECAP of Al-Cu Alloy

2011 ◽  
Vol 702-703 ◽  
pp. 113-118 ◽  
Author(s):  
Perumal Venkatachalam ◽  
Shibayan Roy ◽  
V. Thomas Paul ◽  
M. Vijayalakshmi ◽  
Balasubramanian Ravisankar ◽  
...  
Keyword(s):  
Texture Evolution ◽  
Outer Region ◽  
Al Alloy ◽  
Channel Angle ◽  
Angular Pressing ◽  
Cu Alloy ◽  
Solution Treated ◽  
Evolution Of Microstructure ◽  
Number Of Passes

The effect of processing routes during Equal Channel Angular Pressing (ECAP) of the Al alloy 2014 with regard to the evolution of microstructure and texture heterogeneity has been studied. The solution treated alloy (768 K for 1 hr) was subjected to ECAP through routes A, BA, BC and C using a die with inter-channel angle 90° upto 5 passes. Texture evolution was studied in the top, middle and bottom of the billets processed through routes A, BA, BC and C. Processing by route A resulted in a stronger texture evolution because of monotonic increase in strain with the number of passes. In route A, texture heterogeneity is more than the routes BC and BA. In routes BC and BA, the texture evolution in outer region near to surface of the billet changes their orientation as the passes increases possibly creating a stronger texture evolution at the top and bottom different from the centre of billet. The heterogeneity in texture evolution is the least less in route C, due to the reversal of shear.

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