Low Resistance and High Reflectance Pt/Rh Contacts to p-Type GaN for GaN-Based Flip Chip Light-Emitting Diodes

2005 ◽  
Vol 152 (1) ◽  
pp. G92 ◽  
Author(s):  
Jae-Ryoung Lee ◽  
Suk-In Na ◽  
Jin-Hee Jeong ◽  
Seung-Nam Lee ◽  
Ja-Soon Jang ◽  
...  
Keyword(s):  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Low Resistance ◽  
P Type ◽  
High Reflectance

Highly Reflective and Low Resistance Indium Tin Oxide/Ag Ohmic Contacts to p-Type GaN for Flip-Chip Light Emitting Diodes

2005 ◽  
Vol 8 (11) ◽  
pp. G320 ◽  
Author(s):  
Woong-Ki Hong ◽  
June-O Song ◽  
Hyun-Gi Hong ◽  
Keun-Yong Ban ◽  
Takhee Lee ◽  
...  
Keyword(s):  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Ohmic Contacts ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Low Resistance ◽  
P Type

Reflective and Low-Resistance Zn∕Rh Contacts to p-Type GaN for Flip-Chip Light-Emitting Diodes

2005 ◽  
Vol 8 (9) ◽  
pp. G227 ◽  
Author(s):  
June-O Song ◽  
Woong-Ki Hong ◽  
Hyun-Gi Hong ◽  
Kyoung-Kook Kim ◽  
Takhee Lee ◽  
...  
Keyword(s):  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Low Resistance ◽  
P Type

Low-resistance and highly-reflective Zn–Ni solid solution/Ag ohmic contacts for flip-chip light-emitting diodes

2003 ◽  
Vol 83 (24) ◽  
pp. 4990-4992 ◽  
Author(s):  
June-O Song ◽  
Dong-Seok Leem ◽  
J. S. Kwak ◽  
O. H. Nam ◽  
Y. Park ◽  
...  
Keyword(s):  
Solid Solution ◽  
Ohmic Contacts ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Low Resistance

Low-resistance Al-based reflectors for high-power GaN-based flip-chip light-emitting diodes

2005 ◽  
Vol 86 (13) ◽  
pp. 133503 ◽  
Author(s):  
June-O Song ◽  
Woong-Ki Hong ◽  
Y. Park ◽  
J. S. Kwak ◽  
Tae-Yeon Seong
Keyword(s):  
High Power ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Low Resistance

INTEGRATION OF N- AND P-CONTACTS TO GaN-BASED LIGHT EMITTING DIODES

2011 ◽  
Vol 20 (03) ◽  
pp. 521-525 ◽  
Author(s):  
WENTING HOU ◽  
THEERADETCH DETCHPROHM ◽  
CHRISTIAN WETZEL
Keyword(s):  
Ohmic Contacts ◽  
Light Emitting Diodes ◽  
Voltage Drop ◽  
Light Emitting ◽  
Low Resistance ◽  
Electrical Devices ◽  
P Type ◽  
Lower Series ◽  
Post Deposition

Low-resistance Ohmic contacts are essential for the fabrication of electrical devices. While low contact resistance has been achieved to p -type layers or n -type layers separately, contacts are likely to degrade when both types need to be integrated into a single fabrication process, in particular when prior mesa etching is required. We present a solution to the problem, resulting in low-resistance Ohmic contacts on n -type GaN layers without post-deposition thermal anneal, while maintaining the quality of typical p -type contacts. We implement an integrated process for both, n - and p -contacts, involving an oxygen pretreatment to fabricate light emitting diodes with lower series resistance in the contacts and lower voltage drop at high current when compared to separately optimized contacts.

Nanoparticle Embedded p-Type Electrodes for GaN-Based Flip-Chip Light Emitting Diodes

2006 ◽  
Vol 6 (11) ◽  
pp. 3547-3550 ◽  
Author(s):  
Joon Seop Kwak ◽  
J.-O. Song ◽  
T.-Y. Seong ◽  
B. I. Kim ◽  
J. Cho ◽  
...  
Keyword(s):  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
P Type

Low resistance and highly reflective Cu–Ni solid solution/Ag ohmic contacts to p-GaN for flip-chip light emitting diodes

2004 ◽  
Vol 201 (12) ◽  
pp. 2823-2826 ◽  
Author(s):  
Dong-Seok Leem ◽  
June-O. Song ◽  
J. S. Kwak ◽  
J. Cho ◽  
H. Kim ◽  
...  
Keyword(s):  
Solid Solution ◽  
Ohmic Contacts ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Low Resistance

Low Resistance and Reflective Mg-Doped Indium Oxide–Ag Ohmic Contacts for Flip-Chip Light-Emitting Diodes

2004 ◽  
Vol 16 (6) ◽  
pp. 1450-1452 ◽  
Author(s):  
J.-O. Song ◽  
D.-S. Leem ◽  
J.S. Kwak ◽  
O.H. Nam ◽  
Y. Park ◽  
...  
Keyword(s):  
Indium Oxide ◽  
Ohmic Contacts ◽  
Flip Chip ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Low Resistance ◽  
Mg Doped
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