The Synergistic Effect of N[sub 2]/H[sub 2] Gases in the Plasma Passivation of Siloxane-Based Low-k Polymer Films

2003 ◽  
Vol 6 (1) ◽  
pp. F4 ◽  
Author(s):  
S. T. Chen ◽  
G. S. Chen ◽  
T. J. Yang ◽  
T. C. Chang ◽  
W. H. Yang
RSC Advances ◽  
2016 ◽  
Vol 6 (73) ◽  
pp. 68560-68567 ◽  
Author(s):  
Lingqiang Kong ◽  
Tianke Qi ◽  
Zhidong Ren ◽  
Yunxia Jin ◽  
Yan Li ◽  
...  

Intrinsic highly cross-linked low-k benzocyclobutene polymer functionalized with adamantyl and perfluorocyclobutylidene.


Author(s):  
Marius Andrei Olariu ◽  
Corneliu Hamciuc ◽  
Mihai Asandulesa ◽  
Elena Hamciuc ◽  
Elena‐Luiza Epure ◽  
...  
Keyword(s):  

2017 ◽  
Vol 35 ◽  
pp. e73
Author(s):  
O. Mayer ◽  
J. Seidlerova ◽  
P. Wohlfahrt ◽  
J. Filipovsky ◽  
R. Cifkova ◽  
...  

1996 ◽  
Vol 436 ◽  
Author(s):  
Qing Ma ◽  
Chuanbin Pan ◽  
Harry Fujimoto ◽  
Baylor Triplett ◽  
Peter Coon ◽  
...  

AbstractFour-point bending method offers significant advantages over more traditional techniques in measuring adhesion properties of thin polymer films. The former utilizes sandwich structure beams where the polymer film and the interface of interest are placed at the center of two elastic bulks. Such confined geometry closely resembles applications where polymer films are used as dielectric layers in IC interconnect technology. In this work, the bonding between a poly(arylene ether) (PAE) based polymer film and an Al film was studied. Ti layers of several different thickness were used as adhesion promoter. The sandwich samples were made by bonding bulk wafers using an epoxy. Fracture energies were seen to increase with the thickness of the Ti layer. Effects of heat treatment were also studied.


2017 ◽  
Vol 46 ◽  
pp. 83-89 ◽  
Author(s):  
Otto Mayer ◽  
Jitka Seidlerová ◽  
Peter Wohlfahrt ◽  
Jan Filipovský ◽  
Renata Cífková ◽  
...  

2004 ◽  
Vol 226 (1-3) ◽  
pp. 155-160 ◽  
Author(s):  
O. Larlus ◽  
S. Mintova ◽  
V. Valtchev ◽  
B. Jean ◽  
T.H. Metzger ◽  
...  

2005 ◽  
Vol 863 ◽  
Author(s):  
Nobutaka Kunimi ◽  
Jun Kawahara ◽  
Keizo Kinoshita ◽  
Akinori Nakano ◽  
Masashi Komatsu ◽  
...  

AbstractA new organic precursor was designed and synthesized in order to form polymer films having low dielectric constants by a plasma-enhanced co-polymerization (PCP) technology. The organic monomer features a large aliphatic hydrocarbon structure, tricyclodecane (TCD) group. Optimized polymer films deposited from the monomer had dielectric constants less than 2.5. A solid 13C-NMR spectrum showed that the TCD moiety in the precursor was included in the polymer without changing the structure. The effect of the deposition temperature on the film structure was studied by analyzing Raman spectra. It was revealed that the dielectric constant is strongly associated with sp2 carbon content in the TCD-based polymer films.


2005 ◽  
Vol 45 (5) ◽  
pp. 640-651 ◽  
Author(s):  
Prathamesh Doshi ◽  
Sindee Simon
Keyword(s):  

2005 ◽  
Author(s):  
Jaeyoung Yang ◽  
Sungwoo Lee ◽  
Kyounghwan Kim ◽  
Donggeun Jung ◽  
Heeyeop Chae
Keyword(s):  

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