Properties of Copper Films Prepared by Chemical Vapor Deposition for Advanced Metallization of Microelectronic Devices

1999 ◽  
Vol 146 (9) ◽  
pp. 3248-3254 ◽  
Author(s):  
R. Kröger ◽  
M. Eizenberg ◽  
D. Cong ◽  
N. Yoshida ◽  
L. Y. Chen ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Copper Films ◽  
Microelectronic Devices

Anisotropic Plasma ChemicalVapor Deposition of Copper Films in Trenches

2003 ◽  
Vol 766 ◽  
Author(s):  
Kosuke Takenaka ◽  
Masao Onishi ◽  
Manabu Takenshita ◽  
Toshio Kinoshita ◽  
Kazunori Koga ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Deposition Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Anisotropic Plasma ◽  
Bottom Surface ◽  
Chemical Vapor Deposition Method ◽  
Copper Films ◽  
Deposition Method ◽  
Via Holes

AbstractAn ion-assisted chemical vapor deposition method by which Cu is deposited preferentially from the bottom of trenches (anisotropic CVD) has been proposed in order to fill small via holes and trenches. By using Ar + H2 + C2H5OH[Cu(hfac)2] discharges with a ratio H2 / (H2 + Ar) = 83%, Cu is filled preferentially from the bottom of trenches without deposition on the sidewall and top surfaces. The deposition rate on the bottom surface of trenches is experimentally found to increase with decreasing its width.

scholarly journals CHEMICAL VAPOR DEPOSITION OF COPPER FOR MICROELECTRONIC DEVICES BASED ON SILICON

1991 ◽  
Vol 02 (C2) ◽  
pp. C2-889-C2-895
Author(s):  
H. DALLAPORTA ◽  
Z. HAMMADI ◽  
R. PIERRISNARD ◽  
A. CROS
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Microelectronic Devices

The role of kinetics in the nucleation and void formation in copper films produced by chemical vapor deposition

2000 ◽  
Vol 88 (4) ◽  
pp. 1867-1872 ◽  
Author(s):  
R. Kröger ◽  
M. Eizenberg ◽  
E. Rabkin ◽  
D. Cong ◽  
L. Chen
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Void Formation ◽  
Chemical Vapor ◽  
Copper Films

Electroenhanced Metallorganic Chemical Vapor Deposition of Copper Films

2007 ◽  
Vol 10 (5) ◽  
pp. D51 ◽  
Author(s):  
Yu-Lin Kuo ◽  
Chiapyng Lee ◽  
Gene Chen ◽  
Kou-Liang Liu ◽  
Yee-Wen Yen
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Copper Films

Ion-induced chemical vapor deposition of copper films with nanocellular microstructures

2003 ◽  
Vol 83 (6) ◽  
pp. 1225-1227
Author(s):  
F. Ross ◽  
C. V. Thompson ◽  
T. Chiang ◽  
H. H. Sawin
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Copper Films
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