High Selectivity Dry Etching of InGaP Over AlInP in BI[sub 3] and BBr[sub 3] Plasma Chemistries

1999 ◽  
Vol 1 (1) ◽  
pp. 56
Author(s):  
J. Hong
Keyword(s):  
1996 ◽  
Vol 45 (1) ◽  
pp. 22-26 ◽  
Author(s):  
K.M. Chang ◽  
T.H. Yeh ◽  
S.W. Wang ◽  
C.H. Li ◽  
J.Y. Yang
Keyword(s):  

1996 ◽  
Vol 449 ◽  
Author(s):  
J. W. Lee ◽  
S. J. Pearton ◽  
C. R. Abernathy ◽  
R. G. Wilson ◽  
B. L. Chai ◽  
...  

ABSTRACTLiGaO2 and LiAlO2 have similar lattice constants to GaN, and may prove useful as substrates for III-nitride epitaxy. We have found that these materials may be wet chemically etched in a number of acid solutions, including HF, at rates between 150–40,000 Å/min. Dry etching with SF6/Ar plasmas provides faster rates than Cl2/Ar or CH4/H2/Ar under Electron Cyclotron Resonance conditions, indicating the fluoride etch products are more volatile that their chloride or metalorganic/hydride counterparts. Dry etch rates are low ( < 2, 000 Å/min), providing high selectivity (>5) over the nitrides. The incorporation of hydrogen in these materials is also of interest because this could provide a reservoir of hydrogen that may passivate dopants in overlying nitride films. In 2H implanted samples, 50 % of the deuterium is lost by evolution from the surface by annealing at 400 °C for 20 min and all of the deuterium is gone at 700°C. The diffusivity of 2H is ∼10-13 cm2/s at 250°C in LiA1O2, approximately two orders of magnitude higher than in LiGaO2.


2000 ◽  
Vol 637 ◽  
Author(s):  
Chiharu Takahashi ◽  
Jun-Ichi Takahashi ◽  
Masaya Notomi ◽  
Itaru Yokohama

AbstractAnisortopic Si dry etching is usually carried out with chlorinated gases for electronic devices such as Si-LSIs. We had another look at Si dry etching with fluorinated gases in order to obtain an ideal air hole for two-dimensional Si photonic crystal. We simulated vertical Si etching, and showed the possibility that single crystal Si can be etched vertically with high selectivity to the etching mask using fluorinated gases. We investigated ECR etching with an SF6-CF4 mixture, and vertical Si etching was achieved at room temperature. High Si/Ni selectivity above 100 was also obtained. Two-dimensional Si photonic crystal with a photonic band gap between 1.25 and 1.51 μm was produced using SF6-CF4 ECR plasma and a thin Ni mask.


2014 ◽  
Vol 61 (3) ◽  
pp. 29-37 ◽  
Author(s):  
Y. Nakao ◽  
T. Matsuo ◽  
A. Teramoto ◽  
H. Utsumi ◽  
K. Hashimoto ◽  
...  

2012 ◽  
Vol 187 ◽  
pp. 245-248
Author(s):  
Chung Kyung Jung ◽  
Sung Wook Joo ◽  
Sang Wook Ryu ◽  
S. Naghshineeh ◽  
Yang Lee ◽  
...  

Plasma dry etching processes are commonly used to fabricate sidewalls of trenches and vias for copper / low-k dual damascene devices. Typically, some polymers remain in the trench and at the via top and sidewall. Other particulate etch residues are may remained in the bottom and on the sidewalls of vias. Generally, the particulate consists of mixtures of copper oxide with polymers. The polymers on the sidewalls and the particulate residues at the bottom of vias must be removed prior to the next process step. Small amounts of polymer are intentionally left on the sidewalls of trenches and vias during the etching in order to achieve a vertical profile and to protect the low-k materials under the etching mask. Until now, the industry has relied mainly on organic solvent containing mixtures to clean etch / ash residues from such devices. The effectiveness of available residue removers varies with the specific process and also depends on which new integration materials are used. New materials typically include Cu, TaN, low-k dielectrics and others [1-. Solvent content is thought to aid the removal of polymer residues and particulates produced during plasma dry etching processes. Therefore, in the past we have used a residue remover which contains DMAC (dimethylacetamide). But the use of DMAC is banned in microelectronic fabrication facilities in Europe because of its toxicity. Thus we wanted to find and evaluate a DMAC-free residue remover for removing polymer residues while maintaining high selectivity to the copper and ILD films.


Nanoscale ◽  
2013 ◽  
Vol 5 (3) ◽  
pp. 984-990 ◽  
Author(s):  
Marco Faustini ◽  
Glenna L. Drisko ◽  
Alban A. Letailleur ◽  
Rafael Salas Montiel ◽  
Cédric Boissière ◽  
...  

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