scholarly journals (Invited) Non-Destructive Characterization of Dielectric - Semiconductor Interfaces by Second Harmonic Generation

2016 ◽  
Vol 72 (2) ◽  
pp. 139-151 ◽  
Author(s):  
I. Ionica ◽  
D. Damianos ◽  
A. Kaminski ◽  
G. Vitrant ◽  
D. Blanc-Pelissier ◽  
...  
Keyword(s):  
Second Harmonic Generation ◽  
Harmonic Generation ◽  
Second Harmonic ◽  
Semiconductor Interfaces ◽  
Non Destructive ◽  
Non Destructive Characterization

scholarly journals (Invited) Second Harmonic Generation: A Powerful Non-Destructive Characterization Technique for Dielectric-on-Semiconductor Interfaces

2020 ◽  
Vol MA2020-01 (15) ◽  
pp. 1050-1050
Author(s):  
Irina Ionica ◽  
Dimitrios Damianos ◽  
Anne Kaminski ◽  
Danièle Blanc-Pélissier ◽  
Gerard Ghibaudo ◽  
...  
Keyword(s):  
Second Harmonic Generation ◽  
Harmonic Generation ◽  
Second Harmonic ◽  
Semiconductor Interfaces ◽  
Characterization Technique ◽  
Non Destructive ◽  
Non Destructive Characterization

scholarly journals (Invited) Second Harmonic Generation: A Powerful Non-Destructive Characterization Technique for Dielectric-on-Semiconductor Interfaces

2020 ◽  
Vol 97 (1) ◽  
pp. 119-130
Author(s):  
Irina Ionica ◽  
Dimitrios Damianos ◽  
Anne Kaminski ◽  
Danièle Blanc-Pélissier ◽  
Gerard Ghibaudo ◽  
...  
Keyword(s):  
Second Harmonic Generation ◽  
Harmonic Generation ◽  
Second Harmonic ◽  
Semiconductor Interfaces ◽  
Characterization Technique ◽  
Non Destructive ◽  
Non Destructive Characterization

Non-Destructive Contamination Detection in Thick and Extremely Thin SOI Wafers Using Optical Second Harmonic Generation

2015 ◽  
Author(s):  
M.C. Kryger ◽  
J.P. Changala ◽  
M.L. Alles
Keyword(s):  
Second Harmonic Generation ◽  
Harmonic Generation ◽  
Second Harmonic ◽  
Characterization Methods ◽  
Optical Second Harmonic Generation ◽  
Interfacial Surface ◽  
Surface Metal ◽  
Thickness Variations ◽  
Non Destructive ◽  
Non Destructive Characterization

Abstract Non-destructive optical second harmonic generation (SHG) is shown to be an effective method for detecting interfacial surface and subsurface non-visual defects in commercial thick and extremely-thin (ET) SOI wafers. A method is demonstrated for removing contributions (noise) from layer thickness variations observed in thick SOI, increasing the sensitivity and enabling detection of trace surface metal contamination. Subsurface contamination, otherwise missed by the standard flow of non-destructive characterization methods, is shown to be detected by SHG

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