(Invited) Baseplate Materials for Securing Reliability of Wide Band Gap Power Semiconductor Module Operating at High Temperatures

2015 ◽  
Vol 69 (11) ◽  
pp. 49-55 ◽  
Author(s):  
H. Takahashi ◽  
T. Anzai ◽  
F. Kato ◽  
S. Sato ◽  
H. Tanisawa ◽  
...  
Keyword(s):  
Band Gap ◽  
High Temperatures ◽  
Wide Band ◽  
Wide Band Gap ◽  
Power Semiconductor

High Temperature Silicon Carbide CMOS Integrated Circuits

2011 ◽  
Vol 679-680 ◽  
pp. 726-729 ◽  
Author(s):  
David T. Clark ◽  
Ewan P. Ramsay ◽  
A.E. Murphy ◽  
Dave A. Smith ◽  
Robin. F. Thompson ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Integrated Circuits ◽  
Band Gap ◽  
High Temperatures ◽  
Wide Band ◽  
Cmos Technology ◽  
Cmos Integrated Circuits ◽  
Wide Band Gap ◽  
Circuit Performance

The wide band-gap of Silicon Carbide (SiC) makes it a material suitable for high temperature integrated circuits [1], potentially operating up to and beyond 450°C. This paper describes the development of a 15V SiC CMOS technology developed to operate at high temperatures, n and p-channel transistor and preliminary circuit performance over temperature achieved in this technology.

scholarly journals Analysing Efficiency and Reliability of High Speed Drive Inverters using Wide Band Gap Power Devices

Machines ◽  
2021 ◽  
Vol 9 (12) ◽  
pp. 350
Author(s):  
Niklas Langmaack ◽  
Florian Lippold ◽  
Daiyi Hu ◽  
Regine Mallwitz
Keyword(s):  
Band Gap ◽  
Power Density ◽  
Semiconductor Devices ◽  
Wide Band ◽  
Switching Frequency ◽  
Electrical Machine ◽  
Wide Band Gap ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
High Switching Frequency

Within the project ‘ARIEL’ an electrical turbo compressor unit for fuel cell applications is deeply investigated. The necessary drive inverter is especially designed for high fundamental frequency and high switching frequency to cope with the requirements of the implemented electrical machine. This paper presents investigations on the inverter’s efficiency and its prospective lifetime at different stages of the development. In the design process different wide band gap power semiconductor devices in discrete packages are evaluated in terms of the achievable power density and efficiency, both by simulations and measurements. Finally, an optimised design using surface mount silicon carbide MOSFETs is developed. Compared to a former inverter design using silicon devices in a three-level topology, the power density of the inverter is significantly increased. The lifetime of power electronic systems is often limited by the lifetime of the power semiconductor devices. Based on loss calculations and the resulting temperature swing of the virtual junction the lifetime of the inverter is estimated for the most frequent operating points and for different mission profiles.

TEM and cathodoluminescence of precipitates in II-VI semiconductors

1988 ◽  
Vol 46 ◽  
pp. 488-489
Author(s):  
Joanna L. Batstone
Keyword(s):  
Crystal Growth ◽  
Band Gap ◽  
Local Strain ◽  
Wide Band ◽  
Optoelectronic Device ◽  
Wide Band Gap ◽  
Bulk Crystal Growth ◽  
Transmission Electron ◽  
Device Applications ◽  
Stoichiometry Control

Interest in II-VI semiconductors centres around optoelectronic device applications. The wide band gap II-VI semiconductors such as ZnS, ZnSe and ZnTe have been used in lasers and electroluminescent displays yielding room temperature blue luminescence. The narrow gap II-VI semiconductors such as CdTe and HgxCd1-x Te are currently used for infrared detectors, where the band gap can be varied continuously by changing the alloy composition x.Two major sources of precipitation can be identified in II-VI materials; (i) dopant introduction leading to local variations in concentration and subsequent precipitation and (ii) Te precipitation in ZnTe, CdTe and HgCdTe due to native point defects which arise from problems associated with stoichiometry control during crystal growth. Precipitation is observed in both bulk crystal growth and epitaxial growth and is frequently associated with segregation and precipitation at dislocations and grain boundaries. Precipitation has been observed using transmission electron microscopy (TEM) which is sensitive to local strain fields around inclusions.

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