Large-field scanning laser ablation system

1997 ◽  
Vol 41 (1.2) ◽  
pp. 131-142 ◽  
Author(s):  
F. E. Doany ◽  
T. Ainsworth ◽  
N. Bobroff ◽  
D. Goodman ◽  
A. E. Rosenbluth
Keyword(s):  
Laser Ablation ◽  
Scanning Laser ◽  
Large Field

scholarly journals Large field-of-view incoherent volumetric imaging in living human retina by confocal oblique scanning laser ophthalmoscopy

2021 ◽  
Author(s):  
Wenjun Shao ◽  
Ji Yi
Keyword(s):  
Clinical Care ◽  
Retinal Imaging ◽  
Field Of View ◽  
Scanning Laser ◽  
Large Field ◽  
Scanning Laser Ophthalmoscopy ◽  
Human Retina ◽  
Label Free ◽  
Volumetric Imaging

Three-dimensional (3D) volumetric imaging of the human retina is instrumental to monitor and diagnose blinding conditions. Although coherent retinal imaging is well established by optical coherence tomography, it is still a large void for incoherent volumetric imaging in the human retina. Here, we report confocal oblique scanning laser ophthalmoscopy (CoSLO), to fill that void and harness incoherent optical contrast in 3D. CoSLO uses oblique scanning laser and remote focusing to acquire depth signal in parallel, avoid the lengthy z-stacking, and image a large field of view (FOV). In addition, confocal gating is introduced by a linear sensor array to improve the contrast and resolution. For the first time, we achieved incoherent 3D human retinal imaging with >20° viewing angle within only 5 seconds. The depth resolution is ~45 microns in vivo. We demonstrated label-free incoherent contrast by CoSLO, revealing unique features in the retina. CoSLO will be an important technique for clinical care of retinal conditions and fundamental vision science, by offering unique volumetric incoherent contrasts.

scholarly journals A novel method for the identification of inorganic and organic gunshot residue particles of lead-free ammunitions from the hands of shooters using scanning laser ablation-ICPMS and Raman micro-spectroscopy

The Analyst ◽  
2014 ◽  
Vol 139 (23) ◽  
pp. 6232-6241 ◽  
Author(s):  
Zuriñe Abrego ◽  
Nagore Grijalba ◽  
Nora Unceta ◽  
Maite Maguregui ◽  
Alicia Sanchez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Gunshot Residue ◽  
Lead Free ◽  
Scanning Laser ◽  
Novel Method ◽  
Organic Gunshot Residue ◽  
Inorganic And Organic

SLA-ICPMS and Raman micro-spectroscopy has been applied to the characterization of GSR using modified tape lifts.

Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation

2017 ◽  
Vol 2017 (1) ◽  
pp. 000113-000119
Author(s):  
Habib Hichri ◽  
Shohei Fujishima ◽  
Seongkuk Lee ◽  
Markus Arendt ◽  
Shigeo Nakamura
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Cost Reduction ◽  
High Energy ◽  
Polymer Materials ◽  
Large Field ◽  
Laser Source ◽  
Wafer Level ◽  
Excimer Laser Ablation ◽  
Laser Patterning

Abstract Fan-Out technologies continue to be the main driver for advanced packaging, be it on wafer level (FOWLP) or panel level (FOPLP). There is a continuing need for higher density routing and heterogeneous integration of different devices, but also for continuous cost reduction. While traditional organic flip-chip substrates using semi-additive processes (SAP) have not been able to scale to ultra-fine RDL pitches and via opening below 10um, photo-sensitive spin-on dielectrics and RDL processes used for wafer level packaging do not sufficiently address the cost reduction need, and also face serious technical challenges. This paper presents the latest results from an innovative package RDL and micro via processes using excimer laser ablation in an especially developed non-photo sensitive material, to meet the market's most stringent requirements. To enable panel and wafer based interposers to reduce RDL cost and scale interconnect pitch to 40um and below, excimer laser ablation is introduced as a direct patterning process that uses proven industrialized excimer laser sources to emit high-energy pulses at short wavelengths to remove polymer materials with high precision and high throughput. The combination of a high-power excimer laser source, large-field laser mask and precision projection optics enables the accurate replication and placement of fine resolution circuit patterns without the need for any wet-processing. With excimer laser patterning technology the industry gains a much wider choice of dielectric materials (photo and non-photo) to help achieve further reductions in manufacturing costs as well as enhancements in interposer and package performance. In this paper, we propose a novel patterning process that uses excimer laser ablation to integrate via and RDL traces in one patterning step, followed by seed layer deposition, plating and planarization. The capability of this excimer laser patterning process in non-photo materials Ajinomoto Build-up Film, which is abbreviated to “ABF” in this paper, will be discussed, and its technical robustness and commercial advantages are demonstrated. We will present electrical and reliability data of Via and RDL traces patterned by excimer laser in ABF material.

Large-area thin film preparation by a hybrid scanning laser ablation

1999 ◽  
Author(s):  
You-qing Wang ◽  
Xintang Huang ◽  
Chengwu An ◽  
Qingming Chen ◽  
Qiyang Xu ◽  
...  
Keyword(s):  
Thin Film ◽  
Laser Ablation ◽  
Scanning Laser ◽  
Large Area ◽  
Thin Film Preparation ◽  
Film Preparation

Novel procedure for studying laser-surface material interactions during scanning laser ablation cleaning processes on Cu-based alloys

2021 ◽  
Vol 544 ◽  
pp. 148820
Author(s):  
Elisabetta Di Francia ◽  
Ruth Lahoz ◽  
Delphine Neff ◽  
Victor Rico ◽  
Nicolas Nuns ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Laser Surface ◽  
Scanning Laser ◽  
Surface Material
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