scholarly journals Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors

2016 ◽  
Vol 22 (1) ◽  
pp. 1-21 ◽  
Author(s):  
Hai Wang ◽  
Jian Ma ◽  
Sheldon X.-D. Tan ◽  
Chi Zhang ◽  
He Tang ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
Dynamic Thermal Management ◽  
Management Method ◽  
Many Core

Dynamic Thermal Management for Multi-/Many-Core Systems

2013 ◽  
pp. 59-82
Author(s):  
Yang Ge ◽  
Qinru Qiu
Keyword(s):  
Thermal Management ◽  
Green Computing ◽  
Future Research ◽  
Research Directions ◽  
Detailed Design ◽  
Dynamic Thermal Management ◽  
Design And Implementation ◽  
Chip Temperature ◽  
Future Research Directions ◽  
Many Core

High chip complexity and power consumption raise chip temperature, reduce lifetime, affect the reliability, and increase the cooling cost. Dynamic Thermal Management (DTM) techniques are design to control the chip temperature and tackle the thermal related issues. In this chapter, the authors introduce the working principles and implementation details of some state-of-the-art DTM techniques, in order to boost thermal awareness in the green computing community. They first give the motivation of dynamic thermal management, and divide existing DTM approaches into different categories based on their characteristics. Then the detailed design and implementation issues of these techniques are carefully discussed. Finally, the authors share future research directions in this area.

scholarly journals A 900 μm2 BiCMOS Temperature Sensor for Dynamic Thermal Management

Sensors ◽  
2020 ◽  
Vol 20 (13) ◽  
pp. 3725
Author(s):  
Hernán Aparicio ◽  
Pablo Ituero
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
Thermal Characteristics ◽  
Sampling Period ◽  
Maximum Error ◽  
Cmos Technology ◽  
Dynamic Thermal Management ◽  
Period 2 ◽  
On Chip ◽  
Electronic Technologies

The extreme miniaturization of electronic technologies has turned varying and unpredictable temperatures into a first-class concern for high performance processors which mitigate the problem employing dynamic thermal managements control systems. In order to monitor the thermal profile of the chip, these systems require a collection of on-chip temperature sensors with strict demands in terms of area and power overhead. This paper introduces a sensor topology specially tailored for these requirements. Targeting the 40 nm CMOS technology node, the proposed sensor uses both bipolar and CMOS transistors, benefiting from the stable thermal characteristics of the former and the compactness and speed of the latter. The sensor has been fully characterized through extensive post-layout simulations for a temperature range of 0 ∘ C to 100 ∘ C , achieving a maximum error of ±0.9 ∘ C / considering 3 σ yield and a resolution of 0.5 ∘ C . The area—900 μ m 2 , energy per conversion—1.06 nJ, and sampling period—2 μ s, are very competitive compared to previous works in the literature.

scholarly journals Wide range continuously tunable and fast thermal switching based on compressible graphene composite foams

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Tingting Du ◽  
Zixin Xiong ◽  
Luis Delgado ◽  
Weizhi Liao ◽  
Joseph Peoples ◽  
...  
Keyword(s):  
Thermal Management ◽  
Dynamic Control ◽  
Operating Conditions ◽  
Dynamic Thermal Management ◽  
Graphene Composite ◽  
Continuous Tuning ◽  
Composite Foams ◽  
Wide Range ◽  
Thermal Switches ◽  
Thermal Switching

AbstractThermal switches have gained intense interest recently for enabling dynamic thermal management of electronic devices and batteries that need to function at dramatically varied ambient or operating conditions. However, current approaches have limitations such as the lack of continuous tunability, low switching ratio, low speed, and not being scalable. Here, a continuously tunable, wide-range, and fast thermal switching approach is proposed and demonstrated using compressible graphene composite foams. Large (~8x) continuous tuning of the thermal resistance is achieved from the uncompressed to the fully compressed state. Environmental chamber experiments show that our variable thermal resistor can precisely stabilize the operating temperature of a heat generating device while the ambient temperature varies continuously by ~10 °C or the heat generation rate varies by a factor of 2.7. This thermal device is promising for dynamic control of operating temperatures in battery thermal management, space conditioning, vehicle thermal comfort, and thermal energy storage.

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