Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

The increased accuracy in high-speed positioning of the parallel robot effector in comparison with that of serial robots with a sequential structure is often the main reason for their use in various modern industries, such as the manufacture of printed circuit boards for microelectronics. However, despite the higher theoretical positioning accuracy, due to the kinematic structure of the parallel robot, in practice this characteristic largely depends on the accuracy of manufacturing individual elements of this mechanism, the most important of which are the gearboxes of the drives of its input pairs. A solution to the urgent problem of determining the effect of the manufacturing accuracy of planetary pinion gearboxes included in the drive of a five-link parallel robot on the positioning accuracy of its output link is proposed. A specific relationship has been determined between the grade of accuracy number of the gear part dimensions and the robot positioning accuracy. The unevenness of the positioning accuracy along the coordinate axes of its working area is revealed. It was found that near the area of certain robot positions the accuracy of its positioning drops sharply.

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Distortion of High-Speed Linear Pulses Caused by Transmission on Printed Circuit Boards

Modelling, Identification and Control ◽

10.2316/p.2017.848-018 ◽

2017 ◽

Author(s):

Milan Sigmund ◽

Lubomir Brancik

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

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Advanced Build-up Materials for High Speed Transmission Application

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000305 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000305-000309 ◽

Cited By ~ 2

Author(s):

Shiro Tatsumi ◽

Shohei Fujishima ◽

Hiroyuki Sakauchi

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Transmission Loss ◽

Coefficient Of Thermal Expansion ◽

Strip Line ◽

Circuit Boards ◽

Additive Process ◽

Printed Circuit ◽

Low Dielectric ◽

Transmission Speed

Abstract Build-up process is a highly effective method for miniaturization and high density integration of printed circuit boards. Along with increasing demands for high transmission speed of electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to reduce the transmission loss. Our insulation materials are used in a semi-additive process (SAP) with low dielectric loss tangent, smooth resin surface after desmear, and good insulation reliability. Actually, the transmission loss of strip line substrates and Cu surface roughness impact on transmission loss were measured using our materials. Furthermore, low dielectric molding film with low coefficient of thermal expansion (CTE) and low Young's modulus are introduced.

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