C5M---a control logic layout synthesis system for high-performance microprocessors

1997 ◽  
Author(s):  
Jeffrey L. Burns ◽  
Jack A. Feldman
Keyword(s):  
High Performance ◽  
Control Logic ◽  
Synthesis System ◽  
Layout Synthesis

High Performance Architecture Synthesis System

1994 ◽  
pp. 207-218
Author(s):  
Phillip Duncan ◽  
Shobana Swamy ◽  
Steve Sprouse ◽  
Daniel Potasz ◽  
Rajeev Jain ◽  
...  
Keyword(s):  
High Performance ◽  
Synthesis System

scholarly journals The Modern Research Data Portal: A design pattern for networked, data-intensive science

2017 ◽  
Author(s):  
Kyle Chard ◽  
Eli Dart ◽  
Ian Foster ◽  
David Shifflett ◽  
Steven Tuecke ◽  
...  
Keyword(s):  
Best Practices ◽  
Data Storage ◽  
Design Pattern ◽  
High Speed ◽  
High Performance ◽  
Data Transfer ◽  
Large Data ◽  
Research Data ◽  
Control Logic ◽  
Data Portal

We describe best practices for providing convenient, high-speed, secure access to large data via research data portals. We capture these best practices in a new design pattern, the Modern Research Data Portal, that disaggregates the traditional monolithic web-based data portal to achieve orders-of-magnitude increases in data transfer performance, support new deployment architectures that decouple control logic from data storage, and reduce development and operations costs. We introduce the design pattern; explain how it leverages high-performance Science DMZs and cloud-based data management services; review representative examples at research laboratories and universities, including both experimental facilities and supercomputer sites; describe how to leverage Python APIs for authentication, authorization, data transfer, and data sharing; and use coding examples to demonstrate how these APIs can be used to implement a range of research data portal capabilities. Sample code at a companion web site, https://docs.globus.org/mrdp, provides application skeletons that readers can adapt to realize their own research data portals.

Application of Digital Phase Sensitive Detection for Electromagnetic Propagation Logging while Drilling

2012 ◽  
Vol 468-471 ◽  
pp. 546-549 ◽  
Author(s):  
Sheng Hu Liu ◽  
Ya Min Xing
Keyword(s):  
Electromagnetic Interference ◽  
High Performance ◽  
Sensitive Detection ◽  
Control Logic ◽  
Electromagnetic Propagation ◽  
Calculating Method ◽  
Digital Phase ◽  
Phase Sensitive ◽  
Phase Sensitive Detection ◽  
Logging While Drilling

Intense electromagnetic interference while drilling prevents traditional analog phase sensitive detection (APSD) from correctly acquiring electromagnetic wave signal of logging while drilling (LWD). A digital phase sensitive detection (DPSD) utilizes high-performance floating-point DSP and FPGA to separately process real part and imaginary part of the acquired logging signal, changes traditional calculating method, improves processing speed and calculating precision. The programmable technique used can fully utilize logging information, simplify control logic, improve precision of timing control and measuring precision. Discussed are the principle, characteristics, implement of circuit and analysis of experimental data. Testing result shows that the DPSD may utilize logging information effectively and optimize the LWD system.

scholarly journals The Modern Research Data Portal: A design pattern for networked, data-intensive science

2017 ◽  
Author(s):  
Kyle Chard ◽  
Eli Dart ◽  
Ian Foster ◽  
David Shifflett ◽  
Steven Tuecke ◽  
...  
Keyword(s):  
Best Practices ◽  
Data Storage ◽  
Design Pattern ◽  
High Speed ◽  
High Performance ◽  
Data Transfer ◽  
Large Data ◽  
Research Data ◽  
Control Logic ◽  
Data Portal

We describe best practices for providing convenient, high-speed, secure access to large data via research data portals. We capture these best practices in a new design pattern, the Modern Research Data Portal, that disaggregates the traditional monolithic web-based data portal to achieve orders-of-magnitude increases in data transfer performance, support new deployment architectures that decouple control logic from data storage, and reduce development and operations costs. We introduce the design pattern; explain how it leverages high-performance Science DMZs and cloud-based data management services; review representative examples at research laboratories and universities, including both experimental facilities and supercomputer sites; describe how to leverage Python APIs for authentication, authorization, data transfer, and data sharing; and use coding examples to demonstrate how these APIs can be used to implement a range of research data portal capabilities. Sample code at a companion web site, https://docs.globus.org/mrdp, provides application skeletons that readers can adapt to realize their own research data portals.

Smart Power Module Molding Advances: Evaluating high temperature suitability of Molding Compounds

2013 ◽  
Vol 2013 (1) ◽  
pp. 000177-000182 ◽  
Author(s):  
K.-F. Becker ◽  
T. Thomas ◽  
J. Bauer ◽  
R. Kahle ◽  
T. Braun ◽  
...  
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
High Performance ◽  
Discrete Control ◽  
Maximum Temperature ◽  
Control Logic ◽  
Smart Power ◽  
Transfer Molding ◽  
Molding Compounds ◽  
Temperature Suitability

During the last years within power electronics packaging a trend towards compact power electronics modules for automotive and industrial applications could be observed, where a smart integrated control unit for motor drives is replacing bulky substrates with discrete control logic and power electronics. Most recent modules combine control and power electronics yielding maximum miniaturization. Transfer molding is the method of choice for cost effective encapsulation of such modules due to robustness of the molded modules and moderate cost of packaging. But there are challenges with this type of package: Typically those packages are asymmetric, a substrate with single sided assembly is overmolded on the component side and the substrate backside is exposed providing a heat path for optimized cooling. This asymmetric geometry is prone to yield warped substrates, preventing optimum thermal contact to the heatsink and also putting thermo-mechanical stress on the encapsulated components, possibly reducing reliability. Such packages being truly heterogeneous, combining powerICs, wire bonds, SMDs, controlICs, substrate and leadframe surfaces, the encapsulant used needs to adhere sufficiently to all surfaces present. Additionally those packages need to operate at elevated temperatures for long time, e.g. operate at 200 °C for 1000 h and more, so high thermal stability is of ample importance. Within this paper the main goal is to identify transfer molding compounds suitable for the encapsulation of smart power modules, ready to be used at 200 °C and determine the actual maximum temperature of use of such high performance molding compounds currently available in the market. Summarized a detailed description of the high temperature suitability of high performance molding compounds is provided – additionally an extended test methodology is described to facilitate future material evaluation for HT or harsh environment use of polymeric materials as encapsulants or base materials.

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