scholarly journals Reliable Generation of High-Performance Matrix Algebra

2015 ◽  
Vol 41 (3) ◽  
pp. 1-27 ◽  
Author(s):  
Thomas Nelson ◽  
Geoffrey Belter ◽  
Jeremy G. Siek ◽  
Elizabeth Jessup ◽  
Boyana Norris
Author(s):  
Nikolay A. Moldovyan ◽  
◽  
Alexandr A. Moldovyan ◽  

The article considers the structure of the 2x2 matrix algebra set over a ground finite field GF(p). It is shown that this algebra contains three types of commutative subalgebras of order p2, which differ in the value of the order of their multiplicative group. Formulas describing the number of subalgebras of every type are derived. A new post-quantum digital signature scheme is introduced based on a novel form of the hidden discrete logarithm problem. The scheme is characterized in using scalar multiplication as an additional operation masking the hidden cyclic group in which the basic exponentiation operation is performed when generating the public key. The advantage of the developed signature scheme is the comparatively high performance of the signature generation and verification algorithms as well as the possibility to implement a blind signature protocol on its base.


2008 ◽  
Vol 34 (3) ◽  
pp. 1-25 ◽  
Author(s):  
Kazushige Goto ◽  
Robert A. van de Geijn

2020 ◽  
Vol 2020 ◽  
pp. 1-8
Author(s):  
Lixin Xuan ◽  
Quan Zhou ◽  
Zhiqiang Wang ◽  
Tao Su

In recent years, one kind of novel hybrid polymer containing silicon has already been reported in the field of high-temperature resistance polymer. Gradually, it has been a research hotspot in the field of high-performance matrix resins because of excellent heat resistance and dielectric properties. The composite was prepared by M-aminophenylacetylene terminated polymethyldiphenylethynyl silane (MDPES-2) as a matrix and nonalkali glass cloth as reinforced material using a hot press process. The cure reaction of MDPES-2 was characterized. Meanwhile, heat resistance, mechanical properties, and dielectric properties of MDPES-2 composites were systematically studied in this paper. The results showed that flexural strength at room temperature is 321 MPa and flexural strength retention at 240°C was 98.3%. Flexural strength retention after thermal treatment at 500°C for 7 min was 84%. In addition, ε and dielectric dissipation factor ( tan δ ) were 3.9 and 2.0 × 10 − 3 (10 GHz).


2016 ◽  
Vol 72 (3) ◽  
pp. 804-844 ◽  
Author(s):  
Vasilios Kelefouras ◽  
A. Kritikakou ◽  
Iosif Mporas ◽  
Vasilios Kolonias

Sign in / Sign up

Export Citation Format

Share Document