Vertical Stand Transparent Light-Emitting Diode Architecture for High-Efficiency and High-Power Light-Emitting Diodes

2010 ◽  
Vol 49 (8) ◽  
pp. 080210 ◽  
Author(s):  
Chih-Chien Pan ◽  
Ingrid Koslow ◽  
Junichi Sonoda ◽  
Hiroaki Ohta ◽  
Jun-Seok Ha ◽  
...  
2019 ◽  
Vol 6 (10) ◽  
pp. 2009-2015 ◽  
Author(s):  
Zhiwen Yang ◽  
Qianqian Wu ◽  
Gongli Lin ◽  
Xiaochuan Zhou ◽  
Weijie Wu ◽  
...  

An all-solution processed inverted green quantum dot-based light-emitting diode with concurrent high efficiency and long lifetime is obtained by precisely controlled double shell growth of quantum dots.


2010 ◽  
Vol 3 (10) ◽  
pp. 102101 ◽  
Author(s):  
Yuji Zhao ◽  
Junichi Sonoda ◽  
Chih-Chien Pan ◽  
Stuart Brinkley ◽  
Ingrid Koslow ◽  
...  

2019 ◽  
Vol 10 (35) ◽  
pp. 4872-4878 ◽  
Author(s):  
Yun Hwan Park ◽  
Ho Jin Jang ◽  
Jun Yeob Lee

A highly efficient polymeric thermally activated delayed fluorescent (TADF) organic light-emitting diode was developed by synthesizing a copolymer with 9-vinylcarbazole (VCz) and TADF repeating units.


2010 ◽  
Vol 49 (8) ◽  
pp. 080203 ◽  
Author(s):  
Ingrid L. Koslow ◽  
Junichi Sonoda ◽  
Roy B. Chung ◽  
Chih-Chien Pan ◽  
Stuart Brinkley ◽  
...  

2013 ◽  
Vol 397-400 ◽  
pp. 1767-1771
Author(s):  
Cheng Yi Hsu ◽  
Yu Li Lin

A simple, fast, and reliable characterization method for measuring junction temperature (Tj) on high power GaN-based light emitting diodes (LED) was presented in this study. Thermal characteristics of high power Light-emitting-diode have been analyzed by using a three-dimensional thermal conduction model. Maximum operation temperature has also been calculated. The induced thermal behaviors of the best package processes for LED device with diamond film were investigated by finite element analysis (FEA) and by experimental measurement. The large change of forward operation voltage with temperature in light emitting diodes is advantageously used to measure junction temperature. Using this method, junction temperature (Tj) of LED under various structures and chip mounting methods was measured. It was found that the junction temperature can be reduced considerably by using diamond film substrates to replace sapphire substrate. In this study, the junction temperature can be decreased by about 14.3% under 1.5W power and decreased by about 15.9% under 1W power for 1mm square die. The thermal resistance (RT) can be measured to be 14.8°C/W under 1.5W power and 16.6°C/W under 1.W power.


2007 ◽  
Vol 90 (23) ◽  
pp. 233504 ◽  
Author(s):  
Hong Zhong ◽  
Anurag Tyagi ◽  
Natalie N. Fellows ◽  
Feng Wu ◽  
Roy B. Chung ◽  
...  

2008 ◽  
Vol 32 (2) ◽  
pp. 107-110 ◽  
Author(s):  
Hitoshi SATO ◽  
Hirohiko HIRASAWA ◽  
Hirokuni ASAMIZU ◽  
Natalie FELLOWS ◽  
Anurag TYAGI ◽  
...  

2014 ◽  
Vol 53 (10) ◽  
pp. 100208 ◽  
Author(s):  
Berthold Hahn ◽  
Bastian Galler ◽  
Karl Engl

2007 ◽  
Vol 1 (4) ◽  
pp. 162-164 ◽  
Author(s):  
Hitoshi Sato ◽  
Anurag Tyagi ◽  
Hong Zhong ◽  
Natalie Fellows ◽  
Roy B. Chung ◽  
...  

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