New Negative-Bias-Temperature-Instability Improvement Using Buffer Layer under Highly Compressive Contact Etch Stop Layer for 45-nm-Node Complementary Metal–Oxide–Semiconductor and Beyond
2011 ◽
Vol 50
(4S)
◽
pp. 04DE06
◽
2011 ◽
Vol 50
(4)
◽
pp. 04DE06
◽
2006 ◽
Vol 45
(4B)
◽
pp. 3064-3069
◽
2008 ◽
Vol 47
(4)
◽
pp. 2624-2627
◽