New Negative-Bias-Temperature-Instability Improvement Using Buffer Layer under Highly Compressive Contact Etch Stop Layer for 45-nm-Node Complementary Metal–Oxide–Semiconductor and Beyond

2007 ◽  
Vol 46 (4B) ◽  
pp. 2015-2018
Author(s):  
Cheng-Tung Huang ◽  
Kun-Hsien Lee ◽  
Li-Shian Jeng ◽  
Wen-Han Hung ◽  
Shyh-Fann Ting ◽  
...  
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