AN OPTIMUM SPACING PROBLEM FOR FIVE CHIPS ON A HORIZONTAL SUBSTRATE IN AN ENCLOSURE – NATURAL CONVECTION

2000 ◽  
Vol 01 (01) ◽  
pp. 167-186 ◽  
Author(s):  
YANG LIU ◽  
CHUN WAH LEUNG ◽  
TAL LEUNG CHANG ◽  
PHAN-THUEN NHAN
Keyword(s):  
Natural Convection ◽  
Optimum Spacing ◽  
Spacing Problem ◽  
Horizontal Substrate

An optimum spacing problem for five chips on a horizontal substrate in a vertically insulated enclosure

1999 ◽  
Vol 24 (4) ◽  
pp. 310-318 ◽  
Author(s):  
Y. Liu ◽  
N. Phan-Thien ◽  
C. W. Leung ◽  
T. L. Chan
Keyword(s):  
Optimum Spacing ◽  
Spacing Problem ◽  
Horizontal Substrate

scholarly journals Thermally Optimum Spacing between Inner Plates in Natural Convection Flows in Cavities by Numerical Investigation

Processes ◽  
2020 ◽  
Vol 8 (5) ◽  
pp. 554 ◽  
Author(s):  
Blas Zamora
Keyword(s):  
Natural Convection ◽  
Aspect Ratio ◽  
Numerical Investigation ◽  
Thermophysical Properties ◽  
Electronic Equipment ◽  
Passive Devices ◽  
Wide Range ◽  
Optimum Spacing ◽  
Rayleigh Numbers ◽  
Wall Spacing

Buoyancy-driven airflow that included two isothermal inner plates established in a vented cavity is investigated numerically. The thermally optimum wall-to-wall spacing of the immersed channel, as well as its dependence with respect to the relevant governing parameters, are determined. Results are presented as a function of the aspect ratio b/H for a wide range of Rayleigh numbers RaH. A logarithmic correlation for the optimum (b/H)opt as a function of RaH is presented. In addition, since the outlined configuration might be subject to intense heating conditions, the influence of considering variable thermophysical properties is also included in the analysis. In fact, an appreciable influence of the variation of properties on (b/H)opt is also detected for a representative value of RaH = 109. Obtained results can be directly applied to the optimization of electronic equipment cooling, or even to thermal passive devices in buildings.

Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection From Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure

1999 ◽  
Vol 121 (4) ◽  
pp. 992-1001 ◽  
Author(s):  
V. H. Adams ◽  
Y. Joshi ◽  
D. L. Blackburn
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Aspect Ratio ◽  
Three Dimensional ◽  
Thermal Conductance ◽  
Flow Characteristics ◽  
Convection Flow ◽  
Heat Sources ◽  
Length Width ◽  
Horizontal Substrate

Three-dimensional natural convection flow and heat transfer were numerically studied for a three-by-three array of discrete protruding heat sources on a horizontal substrate in an air-filled, rectangular, narrow-aspect-ratio enclosure with length, width, and height ratio of 6:6:1. The governing equations for natural convection in air, coupled with conjugate conduction and radiation within the enclosure were solved using a finite volume method. The study examines the complex thermal interactions between the heat sources, substrate, and enclosure walls as affected by the thermal conductance of the walls and substrate with the intent of determining which physical effects and level of detail are necessary to accurately predict thermal behavior of discretely heated enclosures. The influence of radiation on the overall heat transfer is given particular attention. The three-dimensionality of the problem was evident in the overall flow characteristics and in the convective heat transfer edge effects on the heat source surfaces. Excellent agreement between temperature predictions on the heat sources and substrate and experimental measurements was obtained for modified Rayleigh numbers in the range of 9.7 × 105 to 1.6 × 107.

Experimental study of optimum spacing problem in the cooling of simulated electronic package

2001 ◽  
Vol 37 (2-3) ◽  
pp. 251-257 ◽  
Author(s):  
S. Chen ◽  
Y. Liu ◽  
S. F. Chan ◽  
C. W. Leung ◽  
T. L. Chan
Keyword(s):  
Experimental Study ◽  
Electronic Package ◽  
Optimum Spacing ◽  
Spacing Problem
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