An optimum spacing problem for four chips on a horizontal substrate – mixed convection

2000 ◽  
Vol 26 (5) ◽  
pp. 470-477 ◽  
Author(s):  
Y. Liu ◽  
S. Chen ◽  
B. W. Shiu
Keyword(s):  
Mixed Convection ◽  
Optimum Spacing ◽  
Spacing Problem ◽  
Horizontal Substrate

An optimum spacing problem for five chips on a horizontal substrate in a vertically insulated enclosure

1999 ◽  
Vol 24 (4) ◽  
pp. 310-318 ◽  
Author(s):  
Y. Liu ◽  
N. Phan-Thien ◽  
C. W. Leung ◽  
T. L. Chan
Keyword(s):  
Optimum Spacing ◽  
Spacing Problem ◽  
Horizontal Substrate

Experimental study of optimum spacing problem in the cooling of simulated electronic package

2001 ◽  
Vol 37 (2-3) ◽  
pp. 251-257 ◽  
Author(s):  
S. Chen ◽  
Y. Liu ◽  
S. F. Chan ◽  
C. W. Leung ◽  
T. L. Chan
Keyword(s):  
Experimental Study ◽  
Electronic Package ◽  
Optimum Spacing ◽  
Spacing Problem
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