Thermal analysis of forced-air and thermosyphon cooling systems for the Inuvik airport expansion

1991 ◽  
Vol 28 (3) ◽  
pp. 399-409 ◽  
Author(s):  
L. B. Smith ◽  
J. P. Graham ◽  
J. F. Nixon ◽  
A. S. Washuta
Keyword(s):  
Thermal Analysis ◽  
Natural Convection ◽  
Key Words ◽  
Thermal Analyses ◽  
Cooling Systems ◽  
Air Ventilation ◽  
Forced Air ◽  
Department Of National Defence ◽  
Raft Foundations ◽  
National Defence

This paper presents a description of thermal analyses of forced-air ventilation and thermosyphon cooling systems, which were carried out in connection with the design of the concrete raft foundations that support hangars and other major structures to be constructed by the Department of National Defence adjacent to the existing airport near Inuvik, N.W.T. The cooling systems are required to prevent heat from the buildings from thawing the ice-rich permafrost present below the site. The analyses identified those parameters that have the most significant effect on the efficiency of each system. Based partially on the results of the analyses, it was decided to utilize air ventilation for cooling. The system is expected to perform satisfactorily under natural convection; however, the design includes a provision to install air blowers, if this should prove necessary in the future. A number of areas in which further research appears useful have been identified. Key words: permafrost, thermal analysis, raft foundation, hangar, ventilated slab, natural convection, thermosyphons.

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

1999 ◽  
Vol 121 (2) ◽  
pp. 108-115 ◽  
Author(s):  
L. Tang ◽  
Y. K. Joshi
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Boundary Condition ◽  
Natural Convection ◽  
Thermal Analyses ◽  
Heat Fluxes ◽  
Global Model ◽  
System Level ◽  
Integrated Analysis ◽  
Component Level

In the present paper, a methodology is described for the integrated thermal analysis of a laminar natural convection air cooled nonventilated electronic system. This approach is illustrated by modeling an enclosure with electronic components of different sizes mounted on a printed wiring board. First, a global model for the entire enclosure was developed using a finite volume computational fluid dynamics/heat transfer (CFD/CHT) approach on a coarse grid. Thermal information from the global model, in the form of board and component surface temperatures, local heat transfer coefficients and reference temperatures, and heat fluxes, was extracted. These quantities were interpolated on a finer grid using bilinear interpolation and further employed in board and component level thermal analyses as various boundary condition combinations. Thus, thermal analyses at all levels were connected. The component investigated is a leadless ceramic chip carrier (LCCC). The integrated analysis approach was validated by comparing the results for a LCCC package with those obtained from detailed system level thermal analysis for the same package. Two preferred boundary condition combinations are suggested for component level thermal analysis.

Can We Trust on the Thermal Analysis of Metal Organic Powders for thin film preparation?

2012 ◽  
Vol 1449 ◽  
Author(s):  
Jordi Farjas ◽  
Daniel Sanchez-Rodriguez ◽  
Hichem Eloussifi ◽  
Raul Cruz Hidalgo ◽  
Pere Roura ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Analysis ◽  
Thermal Analyses ◽  
Heat And Mass Transport ◽  
Analysis Techniques ◽  
Thin Film Preparation ◽  
Metal Organic ◽  
Organic Precursors ◽  
Film Preparation ◽  
Thermal Analysis Techniques

ABSTRACTThermal analysis techniques are routinely applied to characterize the thermal behavior of metal organic precursors used for oxide film preparation. Since the mass of films is very low, researchers do their thermal analyses on powders and consider that the results are representative of films. We will show here that, in general, this assumption is not true. Several examples involving precursors of YBa2Cu3O7-x (Ba and Y trifluoroacetates and Ba propionate) will serve to appreciate that films can behave very differently than powders due to their enhanced heat and mass transport paths. Ultimately, we will demonstrate that, in some cases, relying on powders thermal analysis may lead to erroneous conclusions.

scholarly journals 3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 373 ◽  
Author(s):  
Lorenzo Pezzana ◽  
Giacomo Riccucci ◽  
Silvia Spriano ◽  
Daniele Battegazzore ◽  
Marco Sangermano ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Analysis ◽  
Boron Nitride ◽  
Thermal Analyses ◽  
Tensile Tests ◽  
Morphological Characterization ◽  
Digital Light Processing ◽  
Form Complex ◽  
K Value ◽  
Enhanced Thermal Conductivity

This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations.

Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

Sign in / Sign up

Export Citation Format

Share Document