Effects of thermal processing on (SimGen)p superlattices
In this work we report an X-ray diffraction study of thermally induced interdiffusion and strain relaxation in molecular beam epitaxy grown (SimGen)p short-period superlattices. Both rapid and furnace thermal annealings in the range 500–700 °C were used to generate structural changes in the various samples. Strain relaxation was studied by measuring the shift of (400) superlattice peaks on annealing. About half of the strain was relieved in the first few minutes of annealing. The remaining strain was relieved at a much lower rate and residual strain persisted even after several hours of heating. Also, the decay of the first order (000) superlattice peak was monitored as a function of annealing time. An initial rapid nonexponential decrease in peak intensity was observed, coincident with the sudden strain relaxation found at short annealing times. A slower, exponential decay rate was observed at longer times, so that a wavelength-dependent interdiffusion coefficient Dλ could be calculated. The variation of Dλ with the superlattice period and the effect of different substrates and buffer layers was studied. Diffusion was faster in structures alternating thin Si and thick Ge layers suggesting that migration of Si into Ge is the dominant diffusion process.